Aperture plate for a nebulizer

Patent metadata

Field	Value
Publication number	US-11679209-B2
Application number	US-201916686286-A
Country	US
Kind code	B2
Filing date	Nov 18, 2019
Priority date	Jun 11, 2012
Publication date	Jun 20, 2023
Grant date	Jun 20, 2023

Abstract

A photo-resist ( 21 ) is applied in a pattern or vertical columns having the dimensions of holes or pores of the aperture plate to be produced. This mask pattern provides the apertures which define the aerosol particle size, having up to 2500 holes per square mm. There is electro-deposition of metal ( 22 ) into the spaces around the columns ( 21 ). There is further application of a second photo-resist mask ( 25 ) of much larger (wider and taller) columns, encompassing the area of a number of first columns ( 21 ). The hole diameter in the second plating layer is chosen according to a desired flow rate.

First claim

The invention claimed is:

1. An aperture plate wafer comprising:
a bottom layer with tapered aerosol-forming through holes; and
at least one top layer having spaces, in which said spaces overlie a plurality of the tapered aerosol-forming through holes, wherein the at least one top layer directly contacts the bottom layer so as to completely occlude and inter-fill some of the tapered aerosol-forming through holes in the bottom layer.

2. The aperture plate wafer of claim 1 , wherein the tapered aerosol-forming through holes are funnel-shaped.

3. The aperture plate wafer of claim 1 , wherein the tapered aerosol-forming through holes are tapered toward a bottom surface of the bottom layer, the bottom surface being opposite a surface that directly contacts the at least one top layer.

4. The aperture plate wafer of claim 1 , wherein the spaces are tapered.

5. The aperture plate wafer of claim 4 , wherein the spaces are tapered toward the tapered aerosol-forming through holes.

6. The aperture plate wafer of claim 4 , wherein the spaces are funnel-shaped.

7. The aperture plate wafer of claim 1 , wherein a material of the bottom layer is the same as a material of the at least one top layer.

8. The aperture plate wafer of claim 1 , wherein the tapered aerosol-forming through holes have a width dimension in the range of 1 μm to 10 μm.

9. The aperture plate wafer of claim 1 , wherein the aperture plate wafer thickness is in the range of 45 μm to 90 μm.

10. An aperture plate wafer comprising:
an outlet layer with aerosol-forming outlet holes; and
at least one reservoir layer having tapered reservoir holes, in which said reservoir holes overlie the plurality of the aerosol-forming outlet holes, wherein the at least one reservoir layer directly contacts the outlet layer so as to completely occlude and inter-fill some of the aerosol-forming outlet holes in the outlet layer.

11. The aperture plate wafer of claim 10 , wherein the reservoir holes are funnel-shaped.

12. The aperture plate wafer of claim 10 , wherein the aerosol-forming outlet holes are tapered toward a bottom surface of the outlet layer, the bottom surface being opposite a surface that directly contacts the at least one reservoir layer.

13. The aperture plate wafer of claim 10 , wherein the reservoir holes are tapered toward the aerosol-forming outlet holes.

14. The aperture plate wafer of claim 10 , wherein the aerosol-forming outlet holes are funnel-shaped.

15. The aperture plate wafer of claim 10 wherein the outlet layer is a bottom layer and the reservoir layer is a top layer, and wherein a material of the bottom layer is a metal and is the same as a material of the top layer.

16. The aperture plate wafer of claim 15 , wherein the material of the bottom layer and the top layer is a plated metal.

17. The aperture plate wafer of claim 10 , wherein the aerosol-forming outlet holes have a width dimension in the range of 1 μm to 10 μm.

18. The aperture plate wafer of claim 10 , wherein the aperture plate wafer thickness is in the range of 45 μm to 90 μm.

19. An aperture plate wafer comprising:
an outlet layer with tapered aerosol-forming outlet holes having a width dimension in the range of 1 μm to 10 μm; and
at least one reservoir layer having tapered reservoir holes that are tapered toward the tapered aerosol-forming outlet holes, in which said reservoir holes overlie the plurality of the aerosol-forming outlet holes, wherein the at least one reservoir layer directly contacts the outlet layer so as to completely occlude and inter-fill some of the tapered aerosol-forming outlet holes in the outlet layer.

20. The aperture plate wafer of claim 19 , wherein a material of the outlet layer is the same as a material of the at least one reservoir layer.

Assignees

• Stamford Devices Ltd

Inventors

• Hogan Brendan

Classifications

• B05B17/0646

  Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto · CPC title

• A61M11/003 Primary

  by passing the aerosol trough sieves or filters · CPC title

• C25D1/08

  Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence) · CPC title

• C25D7/00 Primary

  Electroplating characterised by the article coated · CPC title

• C25D3/567

  containing more than 50% by weight of platinum group metals · CPC title