Plating apparatus and cleaning method for cleaning substrate holder
US-2025270729-A1 · Aug 28, 2025 · US
with means for moving the objects individually through the apparatus during treatment
with means for moving the objects individually through the apparatus during treatment · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C25D17/28 |
| Official title | with means for moving the objects individually through the apparatus during treatment |
| Display label | with means for moving the objects individually through the apparatus during treatment |
| Total patents | 32 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2017 | 3 |
| 2018 | 1 |
| 2019 | 4 |
| 2020 | 5 |
| 2021 | 1 |
| 2022 | 3 |
| 2023 | 3 |
| 2024 | 3 |
| 2025 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Plating method and plating apparatus
US-12351933-B2 · Jul 8, 2025 · US
Electroplating device and method for manufacturing plated product
US-12351930-B2 · Jul 8, 2025 · US
Plating apparatus
US-2025116029-A1 · Apr 10, 2025 · US
Plating apparatus
US-2025116024-A1 · Apr 10, 2025 · US
Plating apparatus
US-2025116025-A1 · Apr 10, 2025 · US
Plating method and plating apparatus
US-2025011966-A1 · Jan 9, 2025 · US
Dual wafer plating fixture for a continuous plating line
US-12024785-B2 · Jul 2, 2024 · US
Semiconductor manufacturing apparatus
US-2024145277-A1 · May 2, 2024 · US
Film formation method for metallic coating and film formation device for metallic coating
US-11913129-B2 · Feb 27, 2024 · US
Information processing device, inference device, machine learning device, substrate plating device, information processing method, inference method, and machine learning method
US-2023356160-A1 · Nov 9, 2023 · US
Dual wafer plating fixture for a continuous plating line
US-2023193502-A1 · Jun 22, 2023 · US
Dual wafer plating fixture for a continuous plating line
US-11598018-B2 · Mar 7, 2023 · US
Electroplating device and method for manufacturing plated product
US-2022411951-A1 · Dec 29, 2022 · US
Film formation method for metallic coating and film formation device for metallic coating
US-2022098753-A1 · Mar 31, 2022 · US
Method for the production of a metal strip coated with a coating of chromium and chromium oxide using an electrolyte solution with a trivalent chromium compound
US-11274373-B2 · Mar 15, 2022 · US
Plating apparatus and plating method
US-11186919-B2 · Nov 30, 2021 · US
Plating apparatus and plating method
US-2020392636-A1 · Dec 17, 2020 · US
Method and apparatus for electrolytically depositing a deposition metal on a workpiece
US-10774437-B2 · Sep 15, 2020 · US
Plating apparatus and plating method
US-10711365-B2 · Jul 14, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C25D17/28?
- CPC C25D17/28 is the Cooperative Patent Classification code for “with means for moving the objects individually through the apparatus during treatment.”
- How many patents are filed under CPC C25D17/28 (with means for moving the objects individually through the apparatus during treatment)?
- Our database includes 32 publications tagged with this CPC code.
- Is patent activity under CPC C25D17/28 growing?
- Publication counts under this code: 3 in 2024 vs 7 in 2025 (latest complete years).