Plating method and plating apparatus

Patent metadata

Field	Value
Publication number	US-12351933-B2
Application number	US-202218275879-A
Country	US
Kind code	B2
Filing date	Aug 2, 2022
Priority date	Aug 2, 2022
Publication date	Jul 8, 2025
Grant date	Jul 8, 2025

Abstract

A plating method is a plating method for performing a plating process of a substrate with a plating apparatus including a substrate holder including a contact member that conductively contacts the substrate, and includes a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted, a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member, a step of stopping the discharging of the liquid, a step of starting decrease of tilt of the substrate holder to a horizontal position concurrently with or within a predetermined time before or after stopping the discharging of the liquid, a step of rotating the substrate holder at a second rotation speed higher than the first rotation speed while the substrate holder is at the horizontal position, and a step of performing the plating process on the substrate after the substrate is attached to the substrate holder.

First claim

What is claimed is:

1. A plating method for performing a plating process of a substrate with a plating apparatus comprising a substrate holder including a contact member that conductively contacts the substrate, the plating method comprising:
a step of tilting the substrate holder,
a step of rotating the substrate holder at a first rotation speed while the substrate holder is tilted,
a step of performing discharging of liquid toward the substrate holder rotating at the first rotation speed to supply the liquid to the contact member,
a step of stopping the discharging of the liquid,
a step of starting decrease of tilt of the substrate holder to a horizontal position concurrently with or within a predetermined time before or after stopping the discharging of the liquid,
a step of rotating the substrate holder at a second rotation speed higher than the first rotation speed while the substrate holder is at the horizontal position,
a step of stopping rotation of the substrate holder at the second rotation speed,
a step of attaching the substrate to the substrate holder that is stopped from being rotated, and
a step of performing the plating process on the attached substrate.

2. The plating method according to claim 1 , wherein the predetermined time is 2 seconds or less.

3. The plating method according to claim 1 , wherein the second rotation speed is 30 rpm or more.

4. The plating method according to claim 1 , wherein the first rotation speed is 8 rpm or more and 15 rpm or less.

5. The plating method according to claim 1 , further comprising:
a step of, after the substrate holder is placed at the horizontal position, moving another member that faces the contact member in the substrate holder apart from the contact member, before rotating the substrate holder at the second rotation speed.

6. The plating method according to claim 1 , wherein in the step of performing the discharging of the liquid, the liquid is discharged toward a plate that presses the substrate when the substrate is disposed in the substrate holder.

7. The plating method according to claim 1 , wherein in the step of performing the discharging of the liquid, the substrate holder is rotated to have a speed component in an orientation from a lower end toward an upper end of the tilted substrate holder at a collision position of the substrate holder with which the discharged liquid collides.

8. The plating method according to claim 7 , wherein in the step of performing the discharging of the liquid, the liquid is discharged to have a speed component in the same orientation as a rotation orientation of the substrate holder at the collision position.

9. The plating method according to claim 8 , wherein in the step of performing the discharging of the liquid, the liquid is discharged from a discharge port along a plane extending toward an upper end side of the substrate holder.

10. The plating method according to claim 1 , wherein the liquid has an electrical conductivity with a value equal to or less than a predetermined value or is deaerated.

Assignees

• Ebara Corp

Inventors

• Tsuji Kazuhito
• Yamamoto Kentaro

Classifications

• C25D21/12 Primary

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D21/08

  Rinsing · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D5/34

  Pretreatment of metallic surfaces to be electroplated · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title