Systems and Methods for Forming Metal Matrix Composites

Patent metadata

Field	Value
Publication number	US-2017362727-A1
Application number	US-201615183224-A
Country	US
Kind code	A1
Filing date	Jun 15, 2016
Priority date	Jun 15, 2016
Publication date	Dec 21, 2017
Grant date	—

Abstract

In certain embodiments, a method comprises placing nonconductive fibers adjacent to a conductive material, immersing the nonconductive fibers and the conductive material in a plating medium, and applying a voltage to the conductive material to initiate electroplating. The method further comprises engulfing, by electroplating, the nonconductive fibers in metal to create a metal matrix composite.

First claim

1 . A method, comprising:
placing nonconductive fibers adjacent to a conductive material; immersing the nonconductive fibers and the conductive material in a plating medium; applying a voltage to the conductive material to initiate electroplating; and engulfing, by electroplating, the nonconductive fibers in metal to create a metal matrix composite.

2 . The method of claim 1 , further comprising:
removing the metal matrix composite from the plating medium; removing the conductive material from the metal matrix composite, wherein the conductive material is paint; and trimming the metal matrix composite.

3 . The method of claim 1 , further comprising:
embedding an electrode in a cell; and applying the conductive material to a surface of the cell, wherein:
the conductive material is paint;
the conductive material is in contact with the electrode; and
applying the voltage to the conductive material comprises applying the voltage to the electrode.

4 . The method of claim 1 , wherein the metal matrix composite comprises a web and a stiffener with a radius between the web and the stiffener.

5 . The method of claim 1 , further comprising masking selected regions of the conductive material, wherein:
the conductive material comprises a first part and a second part; the nonconductive fibers comprise a woven preform; placing the nonconductive fibers adjacent to the conductive material comprises placing the woven preform between the first part and the second part; and the created metal matrix composite joins the first part to the second part.

6 . The method of claim 1 , further comprising:
masking a surface of the metal matrix composite; and applying, after masking the surface of the metal matrix composite, a second voltage to initiate electroplating of an unmasked surface of the metal matrix composite.

7 . The method of claim 1 , wherein the nonconductive fibers are ceramic fibers.

8 . A method, comprising:
placing nonconductive fibers adjacent to a conductive material; placing a form in the nonconductive fibers; immersing the nonconductive fibers, the conductive material, and the form in a plating medium; applying a voltage to the conductive material to initiate electroplating; engulfing, by electroplating, the nonconductive fibers in metal to create a metal matrix composite; and removing the form from the metal matrix composite.

9 . The method of claim 8 , further comprising:
removing the metal matrix composite from the plating medium; removing the conductive material from the metal matrix composite, wherein the conductive material is paint; and trimming the metal matrix composite.

10 . The method of claim 8 , further comprising:
embedding an electrode in a cell; and applying the conductive material to a surface of the cell, wherein:
the conductive material is paint;
the conductive material is in contact with the electrode; and
applying the voltage to the conductive material comprises applying the voltage to the electrode.

11 . The method of claim 8 , further comprising:
masking a surface of the metal matrix composite; and applying, after masking the surface of the metal matrix composite, a second voltage to initiate electroplating of an unmasked surface of the metal matrix composite.

12 . The method of claim 8 , wherein the nonconductive fibers are ceramic fibers.

13 . The method of claim 8 , wherein the form comprises wax.

14 . A metal matrix composite, formed by:
placing nonconductive fibers adjacent to a conductive material; immersing the nonconductive fibers and the conductive material in a plating medium; applying a voltage to the conductive material to initiate electroplating; and engulfing, by electroplating, the nonconductive fibers in metal.

15 . The metal matrix composite of claim 14 , further formed by:
removing the metal matrix composite from the plating medium; removing the conductive material from the metal matrix composite, wherein the conductive material is paint; and trimming the metal matrix composite.

16 . The metal matrix composite of claim 14 , further formed by:
embedding an electrode in a cell; and applying the conductive material to a surface of the cell, wherein:
the conductive material is paint;
the conductive material is in contact with the electrode; and
applying the voltage to the conductive material comprises applying the voltage to the electrode.

17 . The metal matrix composite of claim 14 , wherein the metal matrix composite comprises a web and a stiffener with a radius between the web and the stiffener.

18 . The metal matrix composite of claim 14 , further formed by masking selected regions of the conductive material, wherein:
the conductive material comprises a first part and a second part; the nonconductive fibers comprise a woven preform; placing the nonconductive fibers adjacent to the conductive material comprises placing the woven preform between the first part and the second part; and the metal matrix composite joins the first part to the second part.

19 . The metal matrix composite of claim 14 , further formed by:
masking a surface of the metal matrix composite; and applying, after masking the surface of the metal matrix composite, a second voltage to initiate electroplating of an unmasked surface of the metal matrix composite.

20 . The metal matrix composite of claim 14 , wherein the nonconductive fibers are ceramic fibers.

Assignees

• Lockheed Corp

Inventors

• Thomas Jr William Alfred

Classifications

• B33Y70/00

  Materials specially adapted for additive manufacturing · CPC title

• C25D1/003 Primary

  3D structures, e.g. superposed patterned layers · CPC title

• B33Y10/00

  Processes of additive manufacturing · CPC title

• C25D1/20

  Separation of the formed objects from the electrodes {with no destruction of said electrodes} · CPC title

• B33Y80/00

  Products made by additive manufacturing · CPC title