Electrotype for forming an image during a paper making process

US9739014B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9739014-B2
Application numberUS-201314385804-A
CountryUS
Kind codeB2
Filing dateMar 6, 2013
Priority dateMar 19, 2012
Publication dateAug 22, 2017
Grant dateAug 22, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to improvements in methods of making security features, in particular electrotype security features. The electrotype for forming an image during a paper making process comprises a mesh to which is attached at least one image forming element.

First claim

Opening claim text (preview).

The invention claimed is: 1. An attachment to a face cloth of a cylinder mould for forming an image during a paper making process, the attachment comprising: an electrotype having a mesh; and at least one image forming element attached to the mesh. 2. The attachment as claimed in claim 1 , wherein the at least one image forming element is a plurality of unconnected image forming elements that are attached to the mesh. 3. The attachment as claimed in claim 1 , wherein the at least one image forming element comprises multiple layers. 4. The attachment as claimed in claim 1 , wherein the mesh has a line width in a range of 50-300 microns. 5. The attachment as claimed in claim 4 , wherein the line width is in a range 50-150 microns. 6. The attachment as claimed in claim 5 , wherein the line width is in a range 80-120 microns. 7. The attachment as claimed in claim 1 , wherein the mesh has a line spacing that is in a range of 100-500 microns. 8. The attachment as claimed in claim 7 , wherein the line spacing is in a range of 200-450 microns. 9. The attachment as claimed in claim 8 , wherein the line spacing is in a range of 250-400 microns. 10. The attachment as claimed in claim 1 , wherein the mesh has a thickness that is in a range of 20-150 microns. 11. The attachment as claimed in claim 10 , wherein the thickness is in a range of 50-100 microns. 12. The attachment as claimed in claim 11 , wherein the thickness is in a range of 60-90 microns. 13. A method of forming an electrotype comprising: electroforming a first layer, wherein the electrotype has a mesh and at least one image forming element attached to the mesh. 14. The method as claimed in claim 13 further comprising: electroforming one or more additional layers on the first layer, wherein the one or more additional layers comprise the at least one image forming elements without the mesh. 15. The method as claimed in claim 13 further comprising: forming a first intermediate product by: a) applying a layer of a conducting material to a support layer of a photopolymer film; b) applying a layer of light sensitive photo resist to the layer of conducting material; and c) applying a first mask comprising a mesh pattern and an image to the layer of resist; forming a second intermediate product by: d) exposing the first intermediate product to ultraviolet light; and e) washing away the resist on the unexposed regions covered by the mask; forming a third intermediate product by: f) immersing the second intermediate product in an electroforming solution and depositing metal in the regions not covered by the resist. 16. The method as claimed in claim 15 further comprising: repeating steps a) to f) one or more times having replaced the first mask of step c) with a second mask comprising the image without the mesh pattern, to form one or more additional layers on the first layer. 17. The method as claimed in claim 13 , wherein the first layer is deposited to a thickness in a range of 20-150 microns. 18. The method as claimed in claim 17 , wherein the first layer is deposited to a thickness in a range of 50-100 microns. 19. The method as claimed in claim 18 , wherein the first layer is deposited to a thickness in a range of 60-90 microns. 20. The method as claimed in claim 14 , wherein the one or more additional layers are deposited to a thickness in a range of 20-150 microns. 21. The method as claimed in claim 20 , wherein the one or more additional layers are deposited to a thickness in a range of 50-100 microns. 22. The method as claimed in claim 21 , wherein the one or more additional layers is deposited to a thickness in a range of 60-90 microns. 23. A method for manufacturing security paper comprising: forming an electrotype mark by attaching an electrotype to a cylinder mould of a paper making machine, wherein the electrotype has a mesh and at least one image forming element attached to the mesh. 24. The method as claimed in claim 23 further comprising: forming an electrotype mark integrated with or adjacent to a conventional tonal watermark, the conventional tonal watermark being formed by embossings in a face cloth of the cylinder mould. 25. The method as claimed in claim 24 , wherein the watermark is an embossed multi-tonal watermark which comprises a flat non-embossed region for incorporation of the electrotype mark.

Assignees

Inventors

Classifications

  • of the cylinder type · CPC title

  • Perforated or foraminous objects, e.g. sieves (C25D1/10 takes precedence) · CPC title

  • Agents facilitating proof of genuineness or preventing fraudulent alteration, e.g. for security paper (watermarking B41M3/10, D21F1/44; security printing B41M3/14; securities or banknotes characterised by colour effects B42D25/29, B42D25/30; testing paper currency or valuable papers for genuineness G07D7/00) · CPC title

  • Electroforming · CPC title

  • B42D25/29Primary

    Securities; Bank notes · CPC title

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Frequently asked questions

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What does patent US9739014B2 cover?
The invention relates to improvements in methods of making security features, in particular electrotype security features. The electrotype for forming an image during a paper making process comprises a mesh to which is attached at least one image forming element.
Who is the assignee on this patent?
De La Rue Int Ltd
What technology area does this patent fall under?
Primary CPC classification B42D25/29. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Aug 22 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).