Multi-layer encapsulated structures

Patent metadata

Field	Value
Publication number	US-9752247-B2
Application number	US-201314017510-A
Country	US
Kind code	B2
Filing date	Sep 4, 2013
Priority date	Apr 4, 1997
Publication date	Sep 5, 2017
Grant date	Sep 5, 2017

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

First claim

What is claimed:

1. A multi-layer device, comprising:
a. at least one part comprising:
i. at least one first layer comprising at least one first planarized material;
ii. at least one second layer comprising at least one core material and at least one second material, whereby the at least one second material completely surrounds the sides of the at least one core material and wherein the at least one core material is completely bounded from below by the first planarized material; and
iii. at least one third layer comprising at least one third planarized material wherein the third planarized material completely bounds the at least one core material of the at least one second layer from above;
wherein the at least one core material is completely encapsulated by a combination of the at least one first planarized material, the at least one second material, and the at least one third planarized material; and

wherein the device is selected from the group of devices consisting of: (1) a device with hollow internal features, (2) a device with cantilever features, (3) a device having a chandelier geometry, (4) a device including a plurality of parts that are connected to one another to form a functional assembly with each of the plurality of parts remaining stationary relative to the other parts, and (5) a device including a plurality of parts that are connected to one another to form a functional assembly with at least two of the parts being movable relative to one another
wherein the at least one first planarized material, the at least one second material, and the at least one third planarized material comprise the same material.

2. The device of claim 1 wherein the same material comprises nickel and the at least one core material comprises copper.

3. The device of claim 1 wherein the at least one second layer is a single layer.

4. The device of claim 1 wherein the at least one first planarized material, the at least one second material, the at least one planarized third material, and the at least one core material comprise metals.

5. The device of claim 1 wherein at least one material of the at least one first planarized material, the at least one second material, the at least one third planarized material, and the at least one core material comprise a material selected from the group consisting of: (1) a polymer material, (2) a ceramic material, (3) a semiconductor material.

6. The device of claim 1 wherein the device is a microscopic device with features in range of a few microns.

7. The device of claim 1 wherein the device is a mesoscopic device.

Assignees

• Univ Southern California

Inventors

• Cohen Adam L

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• C25D5/22

  Electroplating combined with mechanical treatment during the deposition · CPC title

• B81C2201/0197

  Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192 · CPC title

• C25D1/003

  3D structures, e.g. superposed patterned layers · CPC title

• C25D5/10 Primary

  Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) · CPC title