Passivation coating on copper metal surface for copper wire bonding application
US-2026054287-A1 · Feb 26, 2026 · US
copper or alloys of copper
copper or alloys of copper · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23G1/103 |
| Official title | {copper or alloys of copper} |
| Display label | copper or alloys of copper |
| Total patents | 60 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 8 |
| 2017 | 3 |
| 2018 | 1 |
| 2019 | 5 |
| 2020 | 8 |
| 2021 | 4 |
| 2022 | 8 |
| 2023 | 8 |
| 2024 | 5 |
| 2025 | 4 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Silver-plated product and method for producing same
US-2025230566-A1 · Jul 17, 2025 · US
Method for smoothing surface of copper foil and copper foil obtained
US-12325929-B2 · Jun 10, 2025 · US
Silver-plated product and method for producing same
US-12297556-B2 · May 13, 2025 · US
Surface treatment agent, surface treatment method, and area-selective film forming method on substrate surface
US-2025059389-A1 · Feb 20, 2025 · US
Silver-plated product and method for producing same
US-12173425-B2 · Dec 24, 2024 · US
Method for smoothing surface of copper foil and copper foil obtained
US-2024218554-A1 · Jul 4, 2024 · US
Method for anti-corrosion treatment of metallic copper-containing materials
US-11982002-B2 · May 14, 2024 · US
Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer
US-11963308-B2 · Apr 16, 2024 · US
Methods for wet atomic layer etching of copper
US-11866831-B2 · Jan 9, 2024 · US
Substrate liquid processing apparatus, substrate liquid processing method and recording medium
US-11795546-B2 · Oct 24, 2023 · US
Composite copper foil
US-11781236-B2 · Oct 10, 2023 · US
Antibacterial surface treated copper material and a method for preparing the same
US-11672253-B2 · Jun 13, 2023 · US
Methods For Wet Atomic Layer Etching Of Copper
US-2023140900-A1 · May 11, 2023 · US
Silver-plated product and method for producing same
US-2023097787-A1 · Mar 30, 2023 · US
Silver-plated product and method for producing same
US-2023093655-A1 · Mar 23, 2023 · US
Metallic material surface treatment agent, metallic material having surface treatment coating, and manufacturing method therefor
US-11603592-B2 · Mar 14, 2023 · US
Surface-treated copper foil and copper clad laminate
US-2023014153-A1 · Jan 19, 2023 · US
Surface-treated copper foil and copper clad laminate
US-11540389-B1 · Dec 27, 2022 · US
Method and system for cleaning copper-exposed substrate
US-11491517-B2 · Nov 8, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23G1/103?
- CPC C23G1/103 is the Cooperative Patent Classification code for “copper or alloys of copper.”
- How many patents are filed under CPC C23G1/103 (copper or alloys of copper)?
- Our database includes 60 publications tagged with this CPC code.
- Is patent activity under CPC C23G1/103 growing?
- Publication counts under this code: 5 in 2024 vs 4 in 2025 (latest complete years).