Copper alloy wire, copper alloy stranded wire, covered electric wire, and terminal-fitted electric wire
US-2015371726-A1 · Dec 24, 2015 · US
US11672253B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11672253-B2 |
| Application number | US-202117411295-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 25, 2021 |
| Priority date | Nov 30, 2020 |
| Publication date | Jun 13, 2023 |
| Grant date | Jun 13, 2023 |
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A manufacturing method of an antibacterial surface treated copper material includes: etching a metal base material including copper; primary heat-treating the metal base material; coating the metal base material with a composition for a coating; and secondary heat-treating the metal base material. The composition for the coating includes an acryl resin at 40 wt % to 50 wt % and CuO at 1 wt % to 5 wt % for an entire weight of the composition for the coating.
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What is claimed is: 1. A manufacturing method of an antibacterial surface treated copper material, the manufacturing method comprising: etching a metal base material including copper; primary heat-treating the metal base material; coating the metal base material with a composition for a coating; and secondary heat-treating the metal base material, wherein the composition for the coating includes an acryl resin at 40 wt % to 50 wt % and CuO at 1 wt % to 5 wt % for an entire weight of the composition for the coating. 2. The manufacturing method of claim 1 , wherein the metal base material including copper is a brass including copper (Cu) at 65 wt % to 75 wt % and zinc (Zn) at 25 wt % to 35 wt % for the entire weight of the metal base material. 3. The manufacturing method of claim 1 , wherein the etching is performed for 1 minute to 10 minutes by using HCl at a 0.5 N to 3 N concentration. 4. The manufacturing method of claim 1 , wherein the primary heat treatment is performed at 150° C. to 200° C. for 1 hour to 2 hours. 5. The manufacturing method of claim 1 , further comprising degreasing the metal base material after the primary heat treatment of the metal base material and before the coating of the metal base material with the composition for the coating. 6. The manufacturing method of claim 5 , wherein the degreasing is performed for 10 seconds to 10 minutes by using a Na 3 PO 4 aqueous solution of 25 g/l to 35 g/l. 7. The manufacturing method of claim 1 , wherein the composition for the coating further includes a cyclohexanone solvent at 10 wt % to 15 wt %, a melamine hardening agent at 10 wt % to 20 wt %, an aromatic solvent at 5 wt % to 10 wt %, SiO 2 at 10 wt % to 15 wt %, and a phenol resin at 1 wt % to 5 wt % for the entire weight of the composition for the coating. 8. The manufacturing method of claim 1 , wherein the coating is performed by coating the composition for the coating for 1 minute to 10 minutes and drying at 100° C. to 200° C. for 30 minutes to 60 minutes. 9. The manufacturing method of claim 1 , wherein the secondary heat treatment is performed at 100° C. to 150° C. for 1 hour to 2 hours. 10. An antibacterial surface treated copper material comprising: a metal base material including copper; and a coating layer positioned on the metal base material, wherein the coating layer includes an acryl resin at 50 wt % to 65 wt % and CuO at 1.5 wt % to 5 wt % for the entire weight of the coating layer. 11. The antibacterial surface treated copper material of claim 10 , wherein the coating layer further includes a melamine hardening agent at 15 wt % to 20 wt %, SiO 2 at 15 wt % to 20 wt %, and a phenol resin at 1.5 wt % to 5 wt % for the entire weight of the coating layer. 12. The antibacterial surface treated copper material of claim 10 , wherein the thickness of the coating layer is 15 μm or less. 13. The antibacterial surface treated copper material of claim 10 , wherein a metal oxide layer including CuO is not disposed between the metal base material and the coating layer. 14. The antibacterial surface treated copper material of claim 10 , wherein a metal oxide layer including CuO between the metal base material and the coating layer is removed by etching.
with zinc as the next major constituent · CPC title
Copper · CPC title
of copper or alloys based thereon · CPC title
Cleaning or pickling metallic material with solutions or molten salts (with organic solvents C23G5/02) · CPC title
Disinfectants; Antimicrobial compounds or mixtures thereof · CPC title
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