Substrate processing method and storage medium
US-12435427-B2 · Oct 7, 2025 · US
Heat
Heat · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/2033 |
| Official title | {Heat} |
| Display label | Heat |
| Total patents | 26 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 3 |
| 2017 | 2 |
| 2018 | 2 |
| 2019 | 2 |
| 2020 | 3 |
| 2021 | 2 |
| 2022 | 2 |
| 2023 | 4 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Conductive fabric
US-2025109549-A1 · Apr 3, 2025 · US
Substrate processing method and storage medium
US-2023407482-A1 · Dec 21, 2023 · US
Substrate processing apparatus, substrate processing method, and storage medium
US-11773492-B2 · Oct 3, 2023 · US
Method for Manufacturing Conductive Pattern-Provided Structure
US-2023279553-A1 · Sep 7, 2023 · US
Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer
US-11561631-B2 · Jan 24, 2023 · US
Method for producing a printed wiring board
US-11421325-B2 · Aug 23, 2022 · US
Substrate processing apparatus, substrate processing method, and storage medium
US-2022074053-A1 · Mar 10, 2022 · US
Selective plating of three dimensional surfaces to produce decorative and functional effects
US-11015255-B2 · May 25, 2021 · US
Method of manufacturing conductive laminate, conductive laminate, and touch sensor
US-11003297-B2 · May 11, 2021 · US
Precursor film, substrate with plated layer, conductive film, touch panel sensor, touch panel, method for producing conductive film, and composition for forming plated layer
US-2020409488-A1 · Dec 31, 2020 · US
Method for producing a printed wiring board
US-2020378008-A1 · Dec 3, 2020 · US
Selective Plating of Three Dimensional Surfaces to Produce Decorative and Functional Effects
US-2020165739-A1 · May 28, 2020 · US
Method of manufacturing conductive laminate, conductive laminate, and touch sensor
US-2019369812-A1 · Dec 5, 2019 · US
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US-10292265-B2 · May 14, 2019 · US
Adhesion promoting agents for metallization of substrate surfaces
US-9920432-B2 · Mar 20, 2018 · US
Method for plating on surface of non-conductive substrate
US-2018030600-A1 · Feb 1, 2018 · US
Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US-2017290150-A1 · Oct 5, 2017 · US
Method for producing plated component
US-2017135222-A1 · May 11, 2017 · US
Method of metalizing surface and article obtainable
US-9512522-B2 · Dec 6, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/2033?
- CPC C23C18/2033 is the Cooperative Patent Classification code for “Heat.”
- How many patents are filed under CPC C23C18/2033 (Heat)?
- Our database includes 26 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/2033 growing?
- Publication counts under this code: 4 in 2023 vs 2 in 2025 (latest complete years).