Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Patent metadata

Field	Value
Publication number	US-2017290150-A1
Application number	US-201515505619-A
Country	US
Kind code	A1
Filing date	Sep 8, 2015
Priority date	Sep 9, 2014
Publication date	Oct 5, 2017
Grant date	—

Abstract

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

First claim

1 : A substrate for a printed circuit board, comprising:
a base film having insulating properties; and a metal layer stacked on at least one surface of the base film, the base film including a portion where a transition metal in group 10 of the periodic table is present.

2 : The substrate for a printed circuit board according to claim 1 , wherein the transition metal in group 10 comprises nickel or palladium.

3 : The substrate for a printed circuit board according to claim 1 , wherein the portion where the transition metal in group 10 is present includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

4 : The substrate for a printed circuit board according to claim 3 , wherein the transition metal in group 10 is present also in the metal layer, and
content of the transition metal in group 10 in the region is higher than content of the transition metal in group 10 in the metal layer.

5 : The substrate for a printed circuit board according to claim 3 , wherein content of the transition metal in group 10 in the region is quantitatively determined by EDX and found to be 1% or more by mass.

6 : The substrate for a printed circuit board according to claim 1 ,
wherein the metal layer includes: a first conductive layer formed by applying and baking a conductive ink containing metal particles; and a second conductive layer formed by non-electrolytic plating on a surface of the first conductive layer opposite a surface on which the base film lies.

7 : A printed circuit board comprising a conductive pattern,
wherein the conductive pattern is formed by subjecting the metal layer of the substrate for a printed circuit board according to claim 1 to a subtractive process or a semi-additive process.

8 : A method for producing a substrate for a printed circuit board, comprising the steps of:
forming a first conductive layer by applying a conductive ink containing metal particles to at least one surface of a base film having insulating properties and heating the conductive ink; forming a second conductive layer on a surface of the first conductive layer opposite a surface on which the base film lies by non-electrolytic plating with a plating solution containing a transition metal in group 10 of the periodic table; and dispersing the transition metal in group 10 into the base film.

Assignees

• Sumitomo Electric Industries
• Sumitomo Electric Printed Circuits Inc

Inventors

• Kasuga Takashi
• Oka Yoshio
• UEMURA Shigeaki
• Nakayama Shigeyoshi
• Park Jinjoo
• Uehara Sumito
• Ueda Hiroshi
• Miura Kousuke

Classifications

• B22F1/10

  Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

• B22F1/054

  Nanosized particles · CPC title

• Y10T428/12063

  Nonparticulate metal component · CPC title

• C23C18/1692

  Heat-treatment · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title