Copper clad laminate and method for producing the same
US-12402253-B2 · Aug 26, 2025 · US
of organic surfaces, e.g. resins
of organic surfaces, e.g. resins · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C18/20 |
| Official title | of organic surfaces, e.g. resins |
| Display label | of organic surfaces, e.g. resins |
| Total patents | 63 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 2 |
| 2017 | 11 |
| 2018 | 5 |
| 2019 | 11 |
| 2020 | 5 |
| 2021 | 6 |
| 2022 | 4 |
| 2023 | 6 |
| 2024 | 6 |
| 2025 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Suppression of manganese dioxide formation in manganese (iii)-based etching solutions
US-2025188349-A1 · Jun 12, 2025 · US
Surface modification method, method for producing resin plating material, and electroless plating apparatus
US-2025092526-A1 · Mar 20, 2025 · US
Method for manufacturing composite material to be plated and method for manufacturing anisotropic electroconductive sheet
US-2024360562-A1 · Oct 31, 2024 · US
Semiconductor package
US-2024306308-A1 · Sep 12, 2024 · US
Wiring board and production method for same
US-12004305-B2 · Jun 4, 2024 · US
Wiring board and method for manufacturing the same
US-11979990-B2 · May 7, 2024 · US
Compound, substrate for pattern formation, photodegradable coupling agent, pattern formation method, and transistor production method
US-11953833-B2 · Apr 9, 2024 · US
Plating film and plating film production method
US-11912612-B2 · Feb 27, 2024 · US
Plating film and plating film production method
US-2023391664-A1 · Dec 7, 2023 · US
Resin composition, molded article, and method for manufacturing plated molded article
US-2023374300-A1 · Nov 23, 2023 · US
Copper clad laminate and method for producing the same
US-2023284393-A1 · Sep 7, 2023 · US
Copper clad laminate and method for producing the same
US-2023269880-A1 · Aug 24, 2023 · US
Anisotropic conductive sheet, electrical inspection device, and electrical inspection method
US-2023106035-A1 · Apr 6, 2023 · US
Silver-coated resin particle
US-11542381-B2 · Jan 3, 2023 · US
Optical films and methods of manufacturing such optical films
US-2022342126-A1 · Oct 27, 2022 · US
Adhesion between polymer substrates and autocatalytic plates
US-11359287-B2 · Jun 14, 2022 · US
Wiring board and production method for same
US-2022071019-A1 · Mar 3, 2022 · US
Wiring board and method for manufacturing the same
US-2022071018-A1 · Mar 3, 2022 · US
Thermally-conductive resin composition, and complex comprising same
US-11208554-B2 · Dec 28, 2021 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C18/20?
- CPC C23C18/20 is the Cooperative Patent Classification code for “of organic surfaces, e.g. resins.”
- How many patents are filed under CPC C23C18/20 (of organic surfaces, e.g. resins)?
- Our database includes 63 publications tagged with this CPC code.
- Is patent activity under CPC C23C18/20 growing?
- Publication counts under this code: 6 in 2024 vs 6 in 2025 (latest complete years).