Thermally-conductive resin composition, and complex comprising same

Patent metadata

Field	Value
Publication number	US-11208554-B2
Application number	US-201716473778-A
Country	US
Kind code	B2
Filing date	Dec 27, 2017
Priority date	Dec 30, 2016
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

A thermally-conductive resin composition according to the present invention comprises: approximately 10-50 wt % polycarbonate resin; approximately 1-10 wt % glycol-modified polyester resin; approximately 1-15 wt % glass transition temperature depressing agent; approximately 5-20 wt % additive for laser direct structuring; approximately 10-35 wt % boron nitride having average particle size (D50) of approximately 10 μm or greater; and approximately 10-30 wt % glass fiber having a non-circular cross-sectional surface.

First claim

The invention claimed is:

1. A thermally conductive resin composition comprising:
about 10 wt % to about 50 wt % of a polycarbonate resin;
about 1 wt % to about 10 wt % of a glycol-modified polyester resin;
about 1 wt % to about 15 wt % of a glass transition temperature reduction agent;
about 5 wt % to about 20 wt % of an agent for laser direct structuring;
about 10 wt % to about 35 wt % of boron nitride having an average particle diameter (D50) of about 10 μm or more; and
about 10 wt % to about 30 wt % of glass fibers having a non-circular cross-section,
wherein the glycol-modified polyester resin and the agent for laser direct structuring are present in a weight ratio of about 1:2 to about 1:6.

2. The thermally conductive resin composition according to claim 1 , wherein the glycol-modified polyester resin comprises about 30 mol % to about 100 mol % of 1,4-cyclohexanedimethanol (CHDM) based on the total number of moles of diol components.

3. The thermally conductive resin composition according to claim 1 , wherein the glass transition temperature reduction agent comprises a phenoxy phosphagen oligomer.

4. The thermally conductive resin composition according to claim 1 , wherein the agent for laser direct structuring comprises a heavy metal composite oxide spinel and/or a copper salt.

5. The thermally conductive resin composition according to claim 1 , wherein the boron nitride has an average particle diameter (D50) of about 10 μm to about 50 μm.

6. The thermally conductive resin composition according to claim 1 , wherein the glass fibers have a cross-sectional aspect ratio of about 1.5 to about 10.

7. The thermally conductive resin composition according to claim 1 , wherein the glycol-modified polyester resin and the glass transition temperature reduction agent are present in a weight ratio of about 1:2 to about 1:5.

8. The thermally conductive resin composition according to claim 1 , wherein the glycol-modified polyester resin and the boron nitride are present in a weight ratio of about 1:6 to about 1:15.

9. The thermally conductive resin composition according to claim 1 , wherein the glass transition temperature reduction agent and the boron nitride are present in a weight ratio of about 1:2 to about 1:5.

10. The thermally conductive resin composition according to claim 1 , wherein the thermally conductive resin composition satisfies Relations 1 and 2:
1 W/mK≤Ct≤ 2 W/mK,   [Relation1]

where Ct denotes thermal conductivity, as measured in accordance with ASTM E1461;
6.0GPa<FM≤8.5GPa,[Relation2]

where FM denotes flexural modulus, as measured under conditions of 2.8 mm/min in accordance with ASTM D790.

11. A composite comprising:
a resin layer formed of the thermally conductive resin composition according to claim 1 ; and
a metal layer formed on at least one surface of the resin layer.

12. The composite according to claim 11 , wherein the metal layer is formed by plating after laser direct structuring.

13. The composite according to claim 11 , wherein the metal layer is formed in a pattern.

Assignees

• Lotte Advanced Mat Co Ltd

Inventors

• Park Jee Kwon
• Seo Yeong Deuk
• Kim Jung Ki
• Jung Yoo Jin
• Hong Sang Hyun

Classifications

• C23C18/20

  of organic surfaces, e.g. resins · CPC title

• C23C18/16

  by reduction or substitution, e.g. electroless plating (C23C18/54 takes precedence) · CPC title

• C08K3/38

  Boron-containing compounds · CPC title

• C09K5/14

  Solid materials, e.g. powdery or granular · CPC title

• C08K3/22

  of metals · CPC title