Plating film and plating film production method

Patent metadata

Field	Value
Publication number	US-11912612-B2
Application number	US-202218031512-A
Country	US
Kind code	B2
Filing date	Jun 1, 2022
Priority date	Jun 24, 2021
Publication date	Feb 27, 2024
Grant date	Feb 27, 2024

Abstract

The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

First claim

The invention claimed is:

1. A method for producing a plating film to be formed on a glass substrate, comprising:
(I) step I of bringing a reaction solution containing fluorine and an oxide precursor into contact with a surface of a glass substrate to form an oxide layer on the glass substrate;
(II) step II of adding a catalyst to the oxide layer;
(III) step III of removing fluorine in the oxide layer to which the catalyst has been added;
(IV) step IV of forming an electroless plating film on the oxide layer to which the catalyst has been added; and
(V) step V of forming an electrolytic copper plating film on the electroless plating film.

2. The method for producing a plating film according to claim 1 , wherein removing fluorine in step III is at least one step selected from the group consisting of a step of annealing the oxide layer to which the catalyst has been added and a step of bringing the oxide layer to which the catalyst has been added into contact with an alkaline solution.

3. The method for producing a plating film according to claim 2 , wherein the oxide layer comprises at least one element selected from the group consisting of titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

4. The method for producing a plating film according to claim 1 , wherein the electroless plating film is an electroless copper plating film.

5. The method for producing a plating film according to claim 4 , wherein the electroless copper plating film has an average crystal grain size of 500 nm or less.

6. The method for producing a plating film according to claim 5 , wherein the oxide layer comprises at least one element selected from the group consisting of titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

7. The method for producing a plating film according to claim 4 , wherein the oxide layer comprises at least one element selected from the group consisting of titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

8. The method for producing a plating film according to claim 1 , wherein the electroless plating film is an electroless nickel-phosphorus plating film.

9. The method for producing a plating film according to claim 8 , wherein the electroless nickel-phosphorus plating film has a phosphorus content of 4 mass % or more based on the electroless nickel-phosphorus plating film taken as 100 mass %.

10. The method for producing a plating film according to claim 9 , wherein the oxide layer comprises at least one element selected from the group consisting of titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

11. The method for producing a plating film according to claim 8 , wherein the electroless nickel-phosphorus plating film has a thickness of 0.5 μm or more.

12. The method for producing a plating film according to claim 11 , wherein the oxide layer comprises at least one element selected from the group consisting of titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

13. The method for producing a plating film according to claim 8 , wherein the oxide layer comprises at least one element selected from the group consisting of titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

14. The method for producing a plating film according to claim 1 , wherein the oxide layer comprises at least one element selected from the group consisting of titanium, silicon, tin, zirconium, zinc, nickel, indium, vanadium, chromium, manganese, iron, cobalt, and copper.

Assignees

• Okuno Chem Ind Co
• Panasonic Holdings Corp

Inventors

• Tsukuda Mayu
• Nagao Toshimitsu
• Katayama Junichi
• Shimada Kazuya
• Hayamizu Masahito
• Sakata Toshihiko
• Fuku Shuhei
• Hirooka Asuka

Classifications

• C03C17/3618 Primary

  Coatings of type glass/inorganic compound/other inorganic layers, at least one layer being metallic · CPC title

• C03C17/3639

  Multilayers containing at least two functional metal layers · CPC title

• C03C17/3697

  one metallic layer at least being obtained by electroless plating · CPC title

• C03C2217/253

  Cu · CPC title

• C03C2218/115

  electro-enhanced deposition · CPC title