Electronic component package and method for manufacturing electronic component package
US-2024090133-A1 · Mar 14, 2024 · US
Seal ring and method for manufacturing seal ring
US9961791B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9961791-B2 |
| Application number | US-201314396643-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 15, 2013 |
| Priority date | Jun 4, 2012 |
| Publication date | May 1, 2018 |
| Grant date | May 1, 2018 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
This seal ring ( 1 ) is made of a clad material in which a base material layer ( 10 ) and a brazing filler metal layer ( 11 ) arranged on a first surface ( 10 b ) of the base material layer are bonded to each other, and a side brazing filler metal portion ( 11 f ) of the brazing filler metal layer covering a side surface ( 10 c ) of the base material layer is removed.
First claim
Opening claim text (preview).
The invention claimed is: 1. A seal ring employed in an electronic component storing package, comprising a clad material comprising a base material layer and a brazing filler metal layer pressure-bonded on a first surface of the base material layer, wherein the seal ring is made of the clad material which is punched, and the seal ring has substantially no side brazing filler metal portion of the brazing filler metal layer covering a side surface of the base material layer, the brazing filler metal layer mainly contains Ag and Cu, and a concentration of the Ag is greater in a vicinity of an exposed surface of the brazing filler metal layer than a concentration of the Ag in an inner portion of the brazing filler metal layer. 2. The seal ring according to claim 1 , wherein the base material layer includes a rounded corner connecting the first surface of the base material layer and the side surface substantially flattened, and at least the side brazing filler metal portion of the brazing filler metal layer covering the side surface substantially flattened is removed. 3. The seal ring according to claim 1 , wherein the base material layer mainly contains Fe, Ni, and Co.
Assignees
Inventors
Classifications
- H10W76/60Primary
Seals · CPC title
Cu as the principal constituent · CPC title
- H05K5/066Primary
sealed by fusion of the joining parts without bringing material; sealed by brazing · CPC title
the packing combining the sealing function with other functions · CPC title
Ag as the principal constituent · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9961791B2 cover?
- This seal ring ( 1 ) is made of a clad material in which a base material layer ( 10 ) and a brazing filler metal layer ( 11 ) arranged on a first surface ( 10 b ) of the base material layer are bonded to each other, and a side brazing filler metal portion ( 11 f ) of the brazing filler metal layer covering a side surface ( 10 c ) of the base material layer is removed.
- Who is the assignee on this patent?
- Hitachi Metals Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W76/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 01 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).