Methods for in situ formation of dispersoids strengthened refractory alloy in 3d printing and additive manufacturing
US-2024269745-A1 · Aug 15, 2024 · US
Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00 · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C22C27/00 |
| Official title | Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00 |
| Display label | Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00 |
| Total patents | 147 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 10 |
| 2017 | 14 |
| 2018 | 12 |
| 2019 | 15 |
| 2020 | 16 |
| 2021 | 14 |
| 2022 | 14 |
| 2023 | 18 |
| 2024 | 16 |
| 2025 | 6 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Ruthenium alloys for biosensors
US-2020309724-A1 · Oct 1, 2020 · US
Half-heusler compounds for use in thermoelectric generators
US-10629793-B2 · Apr 21, 2020 · US
Anti-corrosion structure and fuel cell employing the same
US-10511030-B2 · Dec 17, 2019 · US
Materials for near field transducers and near field transducers containing same
US-10482914-B2 · Nov 19, 2019 · US
Radiopaque intraluminal stents comprising cobalt-based alloys containing one or more platinum group metals, refractory metals, or combinations thereof
US-10441445-B2 · Oct 15, 2019 · US
Layered Heusler alloys and methods for the fabrication and use thereof
US-10403425-B2 · Sep 3, 2019 · US
Stable nanocrystalline ordering alloy systems and methods of identifying same
US-2019257775-A1 · Aug 22, 2019 · US
Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
US-10375825-B2 · Aug 6, 2019 · US
Stable undercooled metallic particles for engineering at ambient conditions
US-2019203327-A1 · Jul 4, 2019 · US
Glass-melting component
US-2019177201-A1 · Jun 13, 2019 · US
Tantalum sputtering target
US-10266924-B2 · Apr 23, 2019 · US
Stable undercooled metallic particles for engineering at ambient conditions
US-10266925-B2 · Apr 23, 2019 · US
Silicide alloy film for semiconductor device electrode, and production method for silicide alloy film
US-10246770-B2 · Apr 2, 2019 · US
Materials for near field transducers and near field transducers containing same
US-2019088280-A1 · Mar 21, 2019 · US
Stable binary nanocrystalline alloys and methods of identifying same
US-10234410-B2 · Mar 19, 2019 · US
Stable nanocrystalline ordering alloy systems and methods of identifying same
US-10209208-B2 · Feb 19, 2019 · US
Bi-continuous composite of refractory alloy and copper and method for manufacturing the same
US-2019040495-A1 · Feb 7, 2019 · US
Materials for near field transducers and near field transducers containing same
US-2018366153-A1 · Dec 20, 2018 · US
Materials for near field transducers and near field transducers containing same
US-10134436-B2 · Nov 20, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C22C27/00?
- CPC C22C27/00 is the Cooperative Patent Classification code for “Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00.”
- How many patents are filed under CPC C22C27/00 (Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00)?
- Our database includes 147 publications tagged with this CPC code.
- Is patent activity under CPC C22C27/00 growing?
- Publication counts under this code: 16 in 2024 vs 6 in 2025 (latest complete years).