Devices and methods for making polycrystalline alloys
US-11207731-B2 · Dec 28, 2021 · US
Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga
Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C22C1/0483 |
| Official title | {Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga} |
| Display label | Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga |
| Total patents | 95 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 7 |
| 2017 | 9 |
| 2018 | 5 |
| 2019 | 20 |
| 2020 | 10 |
| 2021 | 8 |
| 2022 | 1 |
| 2023 | 8 |
| 2024 | 9 |
| 2025 | 12 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Aluminum based nanogalvanic compositions useful for generating hydrogen gas and low temperature processing thereof
US-11198923-B2 · Dec 14, 2021 · US
Method for manufacturing an Sn:Sb intermetallic phase
US-11139474-B2 · Oct 5, 2021 · US
Production method of rare earth magnet
US-2021272751-A1 · Sep 2, 2021 · US
Repair method and repair material
US-10994366-B2 · May 4, 2021 · US
Synthesis of N-type thermoelectric materials, including Mg—Sn—Ge materials, and methods for fabrication thereof
US-10930834-B2 · Feb 23, 2021 · US
Joining material and method for manufacturing joined body
US-10888961-B2 · Jan 12, 2021 · US
Sputtering target and method for producing sputtering target
US-10883169-B2 · Jan 5, 2021 · US
Steel sheet for containers, and method for producing steel sheet for containers
US-10851467-B2 · Dec 1, 2020 · US
Negative electrode active material for electrical device
US-10818920-B2 · Oct 27, 2020 · US
Cu alloy core bonding wire with Pd coating for semiconductor device
US-10672733-B2 · Jun 2, 2020 · US
Method for producing a thermoelectric material
US-10662507-B2 · May 26, 2020 · US
Electrically conductive adhesive agent, joined body, and joint
US-10650939-B2 · May 12, 2020 · US
Powder comprising PVA resin particles for layer manufacturing and layered shaped article
US-10632671-B2 · Apr 28, 2020 · US
Disintegrable and conformable metallic seal, and method of making the same
US-10612659-B2 · Apr 7, 2020 · US
Negative electrode for electric device and electric device using the same
US-10566608-B2 · Feb 18, 2020 · US
Negative electrode active material for electric device, negative electrode for electric device and electric device
US-10547053-B2 · Jan 28, 2020 · US
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
US-2020013747-A1 · Jan 9, 2020 · US
Cu alloy core bonding wire with Pd coating for semiconductor device
US-10497663-B2 · Dec 3, 2019 · US
Mg-containing Zn alloy coated steel
US-10392686-B2 · Aug 27, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C22C1/0483?
- CPC C22C1/0483 is the Cooperative Patent Classification code for “Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga.”
- How many patents are filed under CPC C22C1/0483 (Alloys based on the low melting point metals Zn, Pb, Sn, Cd, In or Ga)?
- Our database includes 95 publications tagged with this CPC code.
- Is patent activity under CPC C22C1/0483 growing?
- Publication counts under this code: 9 in 2024 vs 12 in 2025 (latest complete years).