Repair method and repair material

US10994366B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10994366-B2
Application numberUS-201816120522-A
CountryUS
Kind codeB2
Filing dateSep 4, 2018
Priority dateJan 7, 2014
Publication dateMay 4, 2021
Grant dateMay 4, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for repairing a damaged part of a member to be repaired, the method comprising: covering a damaged part of a metal surface with a repair material; and heating the repair material to a predetermined temperature to form an alloy layer, wherein the alloy layer contains, as a principal phase, an intermetallic compound predominantly composed of a first metal and a second metal having a melting point higher than that of the first metal; and disposing an auxiliary material containing the first metal on a surface of the repair material and heating the auxiliary material after heating the repair material to the predetermined temperature to form the alloy layer. 2. The repair method according to claim 1 , wherein the first metal has Sn as a main component, and the second metal is at least one alloy selected from the group consisting of a Cu—Ni alloy, a Cu—Mn alloy, a Cu—Al alloy, a Cu—Cr alloy and an Ag—Pd alloy. 3. The repair method according to claim 1 , wherein the metal surface is a metal having Sn as a main component, a metal having Ag as a main component, or a metal having Cu as a main component. 4. The repair method according to claim 1 , wherein the repair material has a film layer containing the first metal as a metal powder and the second metal as an alloy powder. 5. A method for repairing a damaged part of a member to be repaired, the method comprising: covering a damaged part of a metal surface with a repair material; and heating the repair material to a predetermined temperature to form an alloy layer, wherein the alloy layer contains, as a principal phase, an intermetallic compound predominantly composed of a first metal and a second metal having a melting point higher than that of the first metal, wherein the repair material has a film layer containing the first metal as a metal powder and the second metal as an alloy powder, and wherein an auxiliary layer which contains the first metal is disposed on the film layer, and a side of the film layer and the auxiliary layer is abutted against a side of the damaged part. 6. A method for repairing a damaged part of a member to be repaired, the method comprising: covering a damaged part of a metal surface with a repair material; and heating the repair material to a predetermined temperature to form an alloy layer, wherein the alloy layer contains, as a principal phase, an intermetallic compound predominantly composed of a first metal and a second metal having a melting point higher than that of the first metal, wherein the repair material has a film layer containing the first metal as a metal powder and the second metal as an alloy powder, wherein an auxiliary layer containing the first metal and the second metal is disposed on the film layer, and a side of the thick film layer and the auxiliary layer is abutted against a side of the damaged part, and wherein a content of the first metal in the auxiliary layer is larger than a content of the first metal in the film layer. 7. The repair method according to claim 4 , wherein the film layer further contains a reducing agent and a resin. 8. The repair method according to claim 4 , wherein the film layer is disposed on a substrate sheet. 9. The repair method according to claim 1 , wherein the repair material has a multilayer structure of a first layer including the first metal and a second layer including the second metal. 10. The repair method according to claim 1 , wherein the repair material has a multilayer structure of a foil or film made of the second metal and a film layer made of the first metal. 11. The repair method according to claim 1 , wherein the repair material has a multilayer structure of a foil or film made of the first metal and a film layer made of the second metal. 12. The repair method according to claim 1 , wherein the repair material has a multilayer structure of a foil or film made of the first metal and a foil or film made of the second metal.

Assignees

Inventors

Classifications

  • Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

  • Mixtures of metallic powders · CPC title

  • B23K20/026Primary

    with diffusion of soldering material · CPC title

  • Cu as the principal constituent · CPC title

  • Tubes · CPC title

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Frequently asked questions

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What does patent US10994366B2 cover?
A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification B23K20/026. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 04 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).