Etching gas composition, substrate processing apparatus, and pattern forming method using the etching gas composition
US-12410368-B2 · Sep 9, 2025 · US
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containing heavy metal salts in an amount of at least 50% of the non-solvent components
containing heavy metal salts in an amount of at least 50% of the non-solvent components · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09K13/12 |
| Official title | containing heavy metal salts in an amount of at least 50% of the non-solvent components |
| Display label | containing heavy metal salts in an amount of at least 50% of the non-solvent components |
| Total patents | 14 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 1 |
| 2018 | 5 |
| 2020 | 3 |
| 2021 | 1 |
| 2022 | 1 |
| 2023 | 1 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Etching gas composition, substrate processing apparatus, and pattern forming method using the etching gas composition
US-2023407179-A1 · Dec 21, 2023 · US
Method for treating substrate, method for manufacturing semiconductor device, and kit for treating substrate
US-11239093-B2 · Feb 1, 2022 · US
Etchant composition and method of manufacturing wiring substrate using the same
US-10941342-B2 · Mar 9, 2021 · US
Method for treating substrate, method for manufacturing semiconductor device, and kit for treating substrate
US-2020357657-A1 · Nov 12, 2020 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-10825687-B2 · Nov 3, 2020 · US
Etchant composition and method of manufacturing wiring substrate using the same
US-2020024516-A1 · Jan 23, 2020 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-2018251680-A1 · Sep 6, 2018 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9988573-B2 · Jun 5, 2018 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-2018108536-A1 · Apr 19, 2018 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9881801-B2 · Jan 30, 2018 · US
Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
US-9881802-B2 · Jan 30, 2018 · US
Magnetically controllable fluidic etching process
US-9232661-B1 · Jan 5, 2016 · US
Magnetically controllable fluidic etching process
US-9226405-B1 · Dec 29, 2015 · US