Method for manufacturing peeled substrate
US-2020230748-A1 · Jul 23, 2020 · US
containing an alkali metal hydroxide
containing an alkali metal hydroxide · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09K13/02 |
| Official title | containing an alkali metal hydroxide |
| Display label | containing an alkali metal hydroxide |
| Total patents | 137 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 14 |
| 2017 | 6 |
| 2018 | 10 |
| 2019 | 13 |
| 2020 | 14 |
| 2021 | 12 |
| 2022 | 12 |
| 2023 | 13 |
| 2024 | 15 |
| 2025 | 13 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Polishing compositions and methods of use thereof
US-10703937-B2 · Jul 7, 2020 · US
Energy conversion device and method of forming the same
US-10637088-B2 · Apr 28, 2020 · US
Tungsten Chemical Mechanical Polishing For Reduced Oxide Erosion
US-2020024515-A1 · Jan 23, 2020 · US
Hollow polymer micro-truss structures containing pressurized fluids
US-10513056-B1 · Dec 24, 2019 · US
Tungsten Chemical Mechanical Polishing Compositions
US-2019382619-A1 · Dec 19, 2019 · US
Etchant and Etching Process for Substrate of a Semiconductor Device
US-2019293868-A1 · Sep 26, 2019 · US
Composition and process for metallizing nonconductive plastic surfaces
US-10377947-B2 · Aug 13, 2019 · US
Method for improving the resistance to laser flux of an optical component
US-2019233326-A1 · Aug 1, 2019 · US
Etchant and etching process for substrate of a semiconductor device
US-10353147-B2 · Jul 16, 2019 · US
Composition and process for metallizing nonconductive plastic surfaces
US-2019144747-A1 · May 16, 2019 · US
Wet etch chemistry for selective silicon etch
US-2019119570-A1 · Apr 25, 2019 · US
Etching Solution for Selectively Removing Silicon Over Silicon-Germanium Alloy From a Silicon-Germanium/ Silicon Stack During Manufacture of a Semiconductor Device
US-2019085240-A1 · Mar 21, 2019 · US
Method for treating a surface and device implemented
US-10214444-B2 · Feb 26, 2019 · US
Chrome-free etch solutions for chemically resistant polymer materials
US-2019032220-A1 · Jan 31, 2019 · US
Wet etch chemistry for selective silicon etch
US-10179878-B2 · Jan 15, 2019 · US
Composition and process for metallizing nonconductive plastic surfaces
US-10174250-B2 · Jan 8, 2019 · US
Etching Solution For Tungsten And GST Films
US-2018209049-A1 · Jul 26, 2018 · US
Wet etch chemistry for selective silicon etch
US-2018171226-A1 · Jun 21, 2018 · US
Energy conversion device and method of forming the same
US-2018159162-A1 · Jun 7, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C09K13/02?
- CPC C09K13/02 is the Cooperative Patent Classification code for “containing an alkali metal hydroxide.”
- How many patents are filed under CPC C09K13/02 (containing an alkali metal hydroxide)?
- Our database includes 137 publications tagged with this CPC code.
- Is patent activity under CPC C09K13/02 growing?
- Publication counts under this code: 15 in 2024 vs 13 in 2025 (latest complete years).