Wet etch chemistry for selective silicon etch

Patent metadata

Field	Value
Publication number	US-10179878-B2
Application number	US-201715657537-A
Country	US
Kind code	B2
Filing date	Jul 24, 2017
Priority date	Dec 15, 2016
Publication date	Jan 15, 2019
Grant date	Jan 15, 2019

Abstract

For a metal gate replacement integration scheme, the present disclosure describes removing a polysilicon gate electrode with a highly selective wet etch chemistry without damaging surrounding layers. For example, the wet etch chemistry can include one or more alkaline solvents with a steric hindrance amine structure, a buffer system that includes tetramethylammonium hydroxide (TMAH) and monoethanolamine (MEA), one or more polar solvents, and water.

First claim

What is claimed is:

1. A wet etch chemistry comprising:
one or more alkaline solvents, wherein at least one of the alkaline solvents comprises a steric hindrance amine structure;
a buffer system comprising tetramethylammonium hydroxide (TMAH) and monoethanolamine (MEA);
one or more polar solvents; and
water.

2. The wet etch chemistry of claim 1 , wherein the one or more polar solvents have a polarity greater than 4.

3. The wet etch chemistry of claim 1 , further comprising:
an inorganic fluoride-based chemical or an inorganic alkali.

4. The wet etch chemistry of claim 3 , wherein the inorganic fluoride-based chemical and the inorganic alkali comprise hydrofluoric acid (HF) and ammonium hydroxide (NH 4 OH), respectively.

5. The wet etch chemistry of claim 1 , wherein the wet etch chemistry comprises a semi-aqueous system comprising monoethanolamine (MEA), ethylene glycol (EG), tetramethylammonium hydroxide (TMAH), water, and a fluorine-containing surfactant, and wherein a polysilicon to silicon oxide selectivity ratio can be greater than 26000:1 and a polysilicon to silicon nitride (Si x N y ) selectivity ratio or a polysilicon to silicon oxy-carbide (SiO x C y ) selectivity ratio can be greater than 6000:1.

6. The wet etch chemistry of claim 1 , wherein the at least one of the alkaline solvents having the steric hindrance amine structure comprises tetramethylammonium hydroxide (TMAH), tetrabutylammonium hydroxide (TBAH), benzyltrimethylammonium hydroxide, or monoethanolamine (MEA).

7. The wet etch chemistry of claim 1 , wherein the one or more polar solvents comprise sulfone derivatives, carbonate ester derivatives, ether derivatives, alcohol derivatives, furan derivatives, dimethyl sulfoxide, sulfolane, ethylene carbonate, tetrahydrofuran, butyl diglycol, and ethylene glycol (EG).

8. A wet etch chemistry to selectively etch polysilicon or amorphous silicon in a gate replacement process, the wet etch chemistry comprising:
an inorganic fluoride-based chemical or an inorganic alkali;
one or more organic alkaline solvents, with at least one of the alkaline solvents having a steric hindrance amine structure;
one or more polar solvents; and
water.

9. The wet etch chemistry of claim 8 , wherein the at least one alkaline solvents having the steric hindrance amine structure comprises tetramethylammonium hydroxide (TMAH), tetrabutylammonium hydroxide (TBAH), benzyltrimethylammonium hydroxide, or monoethanolamine (MEA).

10. The wet etch chemistry of claim 8 , wherein the one or more polar solvents have a polarity greater than 4 and comprise sulfone derivatives, carbonate ester derivatives, ether derivatives, alcohol derivatives, furan derivatives, dimethyl sulfoxide, sulfolane, ethylene carbonate, tetrahydrofuran, butyl diglycol, and ethylene glycol (EG).

11. The wet etch chemistry of claim 8 , wherein the inorganic fluoride-based chemical and the inorganic alkali comprise hydrofluoric acid (HF) and ammonium hydroxide (NH 4 OH), respectively.

12. The wet etch chemistry of claim 8 , further comprising:
a buffer system comprising tetramethylammonium hydroxide (TMAH) and monoethanolamine (MEA).

13. A wet etch chemistry solution to selectively etch polysilicon or amorphous silicon in a gate replacement process, the wet etch chemistry solution comprising:
alkaline solvents, polar solvents, or combinations thereof, wherein at least one of the alkaline solvents comprises a steric hindrance amine structure and the polar solvents have a polarity greater than 4;
an inorganic fluoride based chemical or an inorganic alkali;
a buffer system comprising tetramethylammonium hydroxide (TMAH) and monoethanolamine (MEA); and
a fluorine-containing surfactant.

14. The wet etch chemistry solution of claim 13 , wherein a concentration of the polar solvents ranges from 1% to 40%.

15. The wet etch chemistry solution of claim 13 , wherein the polar solvents comprise sulfone derivatives, carbonate ester derivatives, ether derivatives, alcohol derivatives, furan derivatives, dimethyl sulfoxide, sulfolane, ethylene carbonate, tetrahydrofuran, butyl diglycol, and ethylene glycol (EG).

16. The wet etch chemistry solution of claim 13 , wherein the at least one of the alkaline solvents comprises tetrabutylammonium hydroxide (TBAH).

17. The wet etch chemistry solution of claim 13 , wherein the MEA is at least 40% of the wet etch chemistry, an ethylene glycol (EG) is at least 5% of the wet chemistry, and the TMAH is less than 1% of the wet etch chemistry.

18. The wet etch chemistry solution of claim 13 , further comprising at least 10% water.

19. The wet etch chemistry solution of claim 13 , wherein the at least one of the alkaline solvents comprises tetrabutylammonium hydroxide (TBAH).

20. The wet etch chemistry solution of claim 13 , wherein the inorganic fluoride-based chemical and the inorganic alkali comprise hydrofluoric acid (HF) and ammonium hydroxide (NH 4 OH), respectively.

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Yang Neng-Jye
• Huang Kuo Bin
• Yeh Ming-Hsi
• Lin Shun Wu
• Wang Yu-Wen
• Lian Jian-Jou
• Chang Shih Min

Classifications

• H10P50/264

  by chemical means · CPC title

• C09K13/08

  containing a fluorine compound · CPC title

• C09K13/06

  with organic material · CPC title

• C09K13/02 Primary

  containing an alkali metal hydroxide · CPC title

• H10P50/667

  by liquid etching only · CPC title