Adhesive composition for semiconductor, adhesive film for semiconductor, and dicing die bonding film
US-10759971-B2 · Sep 1, 2020 · US
Chemistry & Metallurgy · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C09J2201/162 |
| Official title | — |
| Display label | Chemistry & Metallurgy (mapped technology topic) |
| Total patents | 52 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 4 |
| 2016 | 6 |
| 2017 | 11 |
| 2018 | 13 |
| 2019 | 10 |
| 2020 | 8 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-10759971-B2 · Sep 1, 2020 · US
US-10696865-B2 · Jun 30, 2020 · US
US-10647165-B2 · May 12, 2020 · US
US-10640684-B2 · May 5, 2020 · US
US-10633562-B2 · Apr 28, 2020 · US
US-10615070-B2 · Apr 7, 2020 · US
US-10590315-B2 · Mar 17, 2020 · US
US-10570319-B2 · Feb 25, 2020 · US
US-10479056-B2 · Nov 19, 2019 · US
US-10475356-B2 · Nov 12, 2019 · US
US-10438831-B2 · Oct 8, 2019 · US
US-10385238-B2 · Aug 20, 2019 · US
US-10336046-B2 · Jul 2, 2019 · US
US-10328657-B2 · Jun 25, 2019 · US
US-10316220-B2 · Jun 11, 2019 · US
US-10312125-B2 · Jun 4, 2019 · US
US-2019161647-A1 · May 30, 2019 · US
US-10293435-B2 · May 21, 2019 · US
US-10157554-B2 · Dec 18, 2018 · US
US-2018357936-A1 · Dec 13, 2018 · US
Answers are generated from the same data shown on this page.