Semiconductor wafer protective film and method of manufacturing semiconductor device
US-2016133500-A1 · May 12, 2016 · US
US10438831B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10438831-B2 |
| Application number | US-201415318383-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 18, 2014 |
| Priority date | Jun 18, 2014 |
| Publication date | Oct 8, 2019 |
| Grant date | Oct 8, 2019 |
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A base film for dicing sheets that is used in a dicing sheet comprising the base film and a pressure sensitive adhesive layer laminated on one surface of the base film. The base film comprises at least a first resin layer that is in contact with the pressure sensitive adhesive layer of the dicing sheet and a second resin layer that comes into contact with the first resin layer when the base film for dicing sheets is wound up. The second resin layer has a crystallinity of 28% to 45%. The ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0. The ratio of a thickness of the first resin layer to a thickness of the base film for dicing sheets is 25% to 80%.
Opening claim text (preview).
The invention claimed is: 1. A base film for dicing sheets, the base film including a first surface and a second surface, the base film capable of being used in a dicing sheet, the dicing sheet comprising the base film and an optional pressure sensitive adhesive layer laminated on the first surface of the base film, the base film comprising: a first resin layer that includes the first surface of the base film; and a second resin layer that has a crystallinity of 28% to 45% and that includes the second surface of the base film, wherein a ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0, a ratio of a thickness of the first resin layer to a total thickness of the base film is 25% to 80%, and the first resin layer comprises a resin composition that contains a mixture of (i) an ethylene-based copolymer selected from the group consisting of an ethylene/α,β-unsaturated carboxylic acid copolymer and an ethylene/α,β-unsaturated carboxylic acid/α,β-unsaturated carboxylic ester copolymer, (ii) a ternary copolymer having a constitutional unit originated from α-olefin, a constitutional unit originated from glycidyl (meth)acrylate or glycidyl unsaturated ether and a constitutional unit originated from vinyl ester or unsaturated carboxylic ester, and (iii) a polyolefin. 2. The base film for dicing sheets as recited in claim 1 , wherein a further layer is laminated between the first resin layer and the second resin layer, and the further layer has a tensile elastic modulus that is not higher than the tensile elastic modulus of the first resin layer. 3. The base film for dicing sheets as recited in claim 1 , wherein at least the first resin layer and the second resin layer contain an olefin-based resin. 4. The base film for dicing sheets as recited in claim 1 , wherein the second resin layer contains at least one polymer selected from the group consisting of a homopolymer of ethylene; a copolymer of ethylene/(meth)acrylic acid; a copolymer of ethylene/(meth)acrylic ester; and a copolymer of ethylene/(meth)acrylic acid/(meth)acrylic ester. 5. The base film for dicing sheets as recited in claim 1 , wherein the ethylene-based copolymer is an ethylene/(meth)acrylic acid copolymer. 6. The base film for dicing sheets as recited in claim 1 , wherein the ternary copolymer is an ethylene/glycidyl (meth)acrylate/alkyl acrylate ester copolymer. 7. The base film for dicing sheets as recited in claim 1 , wherein the second resin layer contains an ethylene-based copolymer selected the group consisting of a copolymer of ethylene/(meth)acrylic acid; a copolymer of ethylene/(meth)acrylic ester; and a copolymer of ethylene/(meth)acrylic acid/(meth)acrylic ester. 8. The base film for dicing sheets as recited in claim 7 , wherein the ethylene-based copolymer is an ethylene/(meth)acrylic acid copolymer. 9. The base film for dicing sheets as recited in claim 1 , wherein the second resin layer comprises a resin composition that contains a polyethylene-based resin and a thermoplastic elastomer. 10. The base film for dicing sheets as recited in claim 1 , wherein the first resin layer has a tensile elastic modulus of 140 to 400 MPa, and the second resin layer has a tensile elastic modulus of 100 to 290 MPa. 11. The base film for dicing sheets as recited in claim 1 , wherein the base film for dicing sheets is formed by coextrusion molding. 12. A dicing sheet comprising: the base film as recited in claim 1 , and the pressure sensitive adhesive layer laminated onto the first surface of the base film to form the dicing sheet in which the pressure sensitive adhesive layer directly contacts the first resin layer. 13. The base film for dicing sheets as recited in claim 1 , wherein the base film is in a wound state in which the second surface overlaps with one or more portions of the first surface. 14. The base film for dicing sheets as recited in claim 1 , wherein the second resin layer comprises a resin composition selected from the group consisting of (R3) an ethylene-based copolymer (b1) selected from the group consisting of a copolymer of ethylene/(meth)acrylic acid, a copolymer of ethylene/(meth)acrylic ester, and a copolymer of ethylene/(meth)acrylic acid/(meth)acrylic ester, and (R4) a mixture of a polyethylene-based resin (b2) and a thermoplastic elastomer (b3). 15. A base film for dicing sheets, the base film including a first surface and a second surface, the base film capable of being used in a dicing sheet, the dicing sheet comprising the base film and an optional pressure sensitive adhesive layer laminated on the first surface of the base film, the base film comprising: a first resin layer that includes the first surface of the base film; and a second resin layer that has a crystallinity of 28% to 45% and that includes the second surface of the base film, wherein a ratio of a tensile elastic modulus of the first resin layer to a tensile elastic modulus of the second resin layer is 1.2 to 3.0, a ratio of a thickness of the first resin layer to a total thickness of the base film is 25% to 80%, the first resin layer comprises a resin composition that contains a mixture of (a1) an ethylene-based copolymer selected from the group consisting of an ethylene/α,β-unsaturated carboxylic acid copolymer and an ethylene/α,β-unsaturated carboxylic acid/α,β-unsaturated carboxylic ester copolymer, (a2) a ternary copolymer having a constitutional unit originated from α-olefin, a constitutional unit originated from glycidyl (meth)acrylate or glycidyl unsaturated ether and a constitutional unit originated from vinyl ester or unsaturated carboxylic ester, and (a3) a polyolefin, and the second resin layer comprises a resin composition selected from the group consisting of (R3) an ethylene-based copolymer, and (R4) a mixture of a polyethylene-based resin (b2) and a thermoplastic elastomer (b3). 16. The base film for dicing sheets as recited in claim 15 , wherein a further layer is laminated between the first resin layer and the second resin layer, and the further layer has a tensile elastic modulus that is not higher than the tensile elastic modulus of the first resin layer. 17. The base film for dicing sheets as recited in claim 15 , wherein the first resin layer has a tensile elastic modulus of 140 to 400 MPa, and the second resin layer has a tensile elastic modulus of 100 to 290 MPa.
used during dicing or grinding · CPC title
Wafer tapes, e.g. grinding or dicing support tapes · CPC title
using temporarily an auxiliary support · CPC title
in the substrate · CPC title
in the substrate · CPC title
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