Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
US-10155896-B2 · Dec 18, 2018 · US
Binary compounds of nitrogen with aluminium
Binary compounds of nitrogen with aluminium · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08K2003/282 |
| Official title | {Binary compounds of nitrogen with aluminium} |
| Display label | Binary compounds of nitrogen with aluminium |
| Total patents | 370 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 10 |
| 2017 | 20 |
| 2018 | 23 |
| 2019 | 27 |
| 2020 | 50 |
| 2021 | 27 |
| 2022 | 36 |
| 2023 | 57 |
| 2024 | 44 |
| 2025 | 55 |
| 2026 | 8 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Thermally conductive silicone composition and electrical/electronic apparatus
US-10150902-B2 · Dec 11, 2018 · US
Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board
US-10138393-B2 · Nov 27, 2018 · US
Resin composition containing surface-modified inorganic substance, thermally conductive material, and device
US-2018327602-A1 · Nov 15, 2018 · US
Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device
US-10125289-B2 · Nov 13, 2018 · US
Heat conductive sheet
US-10106672-B2 · Oct 23, 2018 · US
Thermally conductive composite material
US-2018272674-A1 · Sep 27, 2018 · US
Acrylic resin composition for sealing, cured product of same, method for producing same, semiconductor device using said resin composition, and method for manufacturing said semiconductor device
US-2018247910-A1 · Aug 30, 2018 · US
Polymer thermal interface material having enhanced thermal conductivity
US-10056314-B2 · Aug 21, 2018 · US
Resin composition and prepreg, resin sheet, laminate, and printed circuit board
US-2018186952-A1 · Jul 5, 2018 · US
Thermally conductive sheet and method for producing thermally conductive sheet
US-10012453-B2 · Jul 3, 2018 · US
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
US-2018179353-A1 · Jun 28, 2018 · US
Adhesive composition and adhesive sheet, and hardened article and semiconductor device using same
US-10002813-B2 · Jun 19, 2018 · US
Thermally conductive composition
US-2018134938-A1 · May 17, 2018 · US
Acrylic resin heat-dissipating foam sheet
US-2018112115-A1 · Apr 26, 2018 · US
Resin composition, resin sheet, resin cured product, and resin substrate
US-2018112029-A1 · Apr 26, 2018 · US
Thermal interface materials with low secant modulus of elasticity and high thermal conductivity
US-2018094183-A1 · Apr 5, 2018 · US
Integrated silicone for protecting electronic devices, circuit module using the same and manufacturing method of circuit module
US-9834686-B2 · Dec 5, 2017 · US
Structure, and electronic component and electronic device including the structure
US-2017338166-A1 · Nov 23, 2017 · US
Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same
US-9809735-B2 · Nov 7, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08K2003/282?
- CPC C08K2003/282 is the Cooperative Patent Classification code for “Binary compounds of nitrogen with aluminium.”
- How many patents are filed under CPC C08K2003/282 (Binary compounds of nitrogen with aluminium)?
- Our database includes 370 publications tagged with this CPC code.
- Is patent activity under CPC C08K2003/282 growing?
- Publication counts under this code: 44 in 2024 vs 55 in 2025 (latest complete years).