Integrated silicone for protecting electronic devices, circuit module using the same and manufacturing method of circuit module

Patent metadata

Field	Value
Publication number	US-9834686-B2
Application number	US-201414537250-A
Country	US
Kind code	B2
Filing date	Nov 10, 2014
Priority date	Nov 20, 2013
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.

First claim

What is claimed is:

1. A circuit module, comprising:
a printed circuit board having a plurality of circuit patterns formed on an insulating layer;
a plurality of electronic devices electrically connected to the circuit patterns by solders; and
an integrated silicone being coated on the circuit patterns, the solders, and the electronic devices, wherein the integrated silicone includes:
a base resin;
a thermal initiator;
a thermally conductive filler;
a photoinitiator; and
an electrostatic discharge (ESD) protecting filler, the ESD protecting filler including aluminum oxide (Al 2 O 3 ), aluminum hydroxide (AlOH), tin oxide (SnO 2 ), or zinc oxide (ZnO),
wherein the ESD protecting filler and the thermally conductive filler are present in an amount of 22 to 32 wt %.

2. The circuit module as claimed in claim 1 , wherein the base resin is contained in an amount of 62 to 75 wt %, based on a total weight of the integrated silicone.

3. The circuit module as claimed in claim 1 , wherein the base resin includes at least one selected from the group of polyurethane acrylate, isobornyl acrylate, modified acrylamide, and hydroxy ethyl methacrylate.

4. The circuit module as claimed in claim 1 , wherein the thermal initiator includes a silane coupling agent.

5. The circuit module as claimed in claim 1 , wherein the thermal initiator is present in an amount of 4 to 5 wt %.

6. The circuit module as claimed in claim 1 , wherein the photoinitiator is present in an amount of 8 to 10 wt %.

7. The circuit module as claimed in claim 1 , wherein the thermally conductive filler includes at least one selected from the group of fumed silica, magnesium oxide (MgO), boron nitride (BN), and aluminum nitride (AlN).

8. The circuit module as claimed in claim 1 , further comprising:
one or more wires electrically connected to the circuit patterns; and
a wire fixing epoxy resin coated on connection regions between the circuit patterns and the wires.

9. The circuit module as claimed in claim 8 , wherein at least one battery cell, at least one temperature sensor, or at least one connector are electrically connected to the wires.

10. The circuit module as claimed in claim 1 , wherein the electronic devices include at least one selected from the group of an integrated circuit semiconductor package, a transistor, a resistor, a capacitor, a positive temperature coefficient (PTC) element, and a fuse.

11. A manufacturing method of a circuit module, the method comprising:
providing a printed circuit board having a plurality of circuit patterns formed on an insulating layer and electrically connected to a plurality of electronic devices by solders;
coating the integrated silicone as claimed in claim 1 on at least one of the circuit patterns, the solders and the electronic devices; and
curing the integrated silicone using light and heat.

12. The manufacturing method as claimed in claim 11 , wherein the curing using light and heat includes controlling a wavelength of light to be between 300 nm and 500 nm and controlling a temperature of the heat to be between 60° C. and 100° C.

13. The manufacturing method as claimed in claim 11 , wherein the curing using light and heat is performed for 10 to 60 seconds.

14. The manufacturing method as claimed in claim 11 , wherein the electronic devices include at least one selected from the group of an integrated circuit semiconductor package, a transistor, a resistor, a capacitor, a positive temperature coefficient (PTC) element, and a fuse.

15. The manufacturing method as claimed in claim 11 , wherein:
one or more wires connect the plurality of electronic devices to the circuit patterns, and
the manufacturing method further includes coating a wire fixing epoxy resin on connection regions between the circuit patterns and the wires, before the curing using light and heat.

Assignees

• Samsung Sdi Co Ltd

Inventors

• Shin Kyungjae
• Kim Kiwoong

Classifications

• H10W74/476

  Organic materials comprising silicon · CPC title

• H10W74/40

  characterised by their materials · CPC title

• C08K2003/2296

  of zinc · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• C08K2003/282

  Binary compounds of nitrogen with aluminium · CPC title