Polymer thermal interface material having enhanced thermal conductivity

Patent metadata

Field	Value
Publication number	US-10056314-B2
Application number	US-201514736120-A
Country	US
Kind code	B2
Filing date	Jun 10, 2015
Priority date	Mar 15, 2013
Publication date	Aug 21, 2018
Grant date	Aug 21, 2018

Abstract

A polymer thermal interface material is described that has enhanced thermal conductivity. In one example, a vinyl-terminated silicone oil is combined with a silicone chain extender, and a thermally conductive filler comprising at least 85% by weight of the material, and comprising surface wetted particles with a range of shapes and sizes. The material may be used for bonding components inside a microelectronic package, for example.

First claim

What is claimed is:

1. A polymer thermal interface material having a cure temperature, the material comprising:
a vinyl-terminated silicone oil, the vinyl-terminated silicone oil comprising Si-vinyl groups;
a silicone chain extender comprising terminal silyl hydride (Si—H) functional groups;
a silicon crosslinker comprising silyl hydride (Si—H) functional groups, wherein the molar ratio of total Si—H functional groups from the silicon chain extender and the silicon crosslinker to the Si-vinyl groups of the vinyl-terminated silicone oil in the thermal interface material is in the range of 0.8-1.2, and wherein a total composition of the thermal interface material comprises 3-15% by weight of the vinyl-terminated silicon oil, 0.1-3% of the silicon crosslinker, and 0.1-3% of the silicon chain extender; and
a thermally conductive filler comprising at least 85 percent by weight of the material, and comprising surface wetted particles with a range of shapes and sizes,
wherein the surface wetted particles comprise a first agent having a boiling point below the cure temperature of the material and a second agent having a boiling point above the cure temperature of the material,
wherein the first agent is formed as a layer of adsorbed molecules on a surface of the filler particles and is present in a quantity sufficient to be adsorbed by and coat the filler particles with no excess first agent that is not adsorbed,
wherein the second agent is applied on the layer in a quantity sufficient to reduce the viscosity of the material, and
wherein the thermal interface material has a volatile content less than 0.2 weight percent at 150° C.

2. The material of claim 1 , wherein the average diameter of the filler particles is within a range of from 8 to 10 μm.

3. The material of claim 1 , wherein the filler particles comprise metal.

4. The material of claim 1 , wherein the surface wetted particles are wetted with agents comprising silanes.

5. The material of claim 4 , wherein the surface wetted particles are wetted with polymeric chemical agents containing surface-reactive groups such as methoxy or chloro groups.

6. The material of claim 1 , wherein the silicone crosslinker in the form of a random co-polymer having at least three silicone-hydrogen bonds (Si—H).

7. The material of claim 1 wherein the conductive filler particles comprise one of aluminum, silver, copper, aluminum nitride, aluminum oxide, zinc oxide, boron nitride, aluminum nitride, silver coated copper, silver coated aluminum, and carbon fibers, and alloys and mixtures thereof.

8. A method of making a thermal interface material, the material having a cure temperature, the method comprising:
surface wetting a plurality of thermal conductive filler particles with a first agent having a boiling point below the cure temperature of the material and then with a second agent having a boiling point above the cure temperature of the material,
wherein the first agent is formed as a layer of adsorbed molecules on a surface of the filler particles,
wherein the first agent is applied in a quantity sufficient to be adsorbed by and coat the filler particles with no excess first agent that is not adsorbed, and
wherein the second agent is applied on the layer in a quantity sufficient to reduce the viscosity of the material;
combining a vinyl-terminated silicone oil comprising Si-vinyl groups, a silicone chain extender comprising terminal silyl hydride (Si—H) functional groups, a silicon crosslinker comprising silyl hydride (Si—H) functional groups, wherein the molar ratio of total Si—H functional groups from the silicon chain extender and the silicon crosslinker to the Si-vinyl groups of the vinyl-terminated silicone oil in the thermal interface material is in the range of 0.8-1.2, and wherein a total composition of the thermal interface material comprises 3-15% by weight of the vinyl-terminated silicon oil, 0.1-3% of the silicon crosslinker, and 0.1-3% of the silicon chain extender, and the wetted filler particles wherein the wetted filler particles are at least 85 percent by weight of the material, and wherein the thermal interface material has a volatile contentless than 0.2 weight percent at 150° C.

9. The method of claim 8 , further comprising combining at least one coupling agent for the filler.

10. The method of claim 8 , further comprising combining at least one adhesion promoter.

11. The method of claim 8 , wherein the thermal conductive filler particles comprise one of aluminum, silver, copper, aluminum nitride, aluminum oxide, zinc oxide, boron nitride, aluminum nitride, silver coated copper, silver coated aluminum, and carbon fibers, and alloys and mixtures thereof.

12. A semiconductor package comprising:
a substrate;
a semiconductor die coupled to the substrate; a heat spreader coupled to the die; and
a thermal interface material between the die and the heat spreader to mechanically and thermally couple the heat spreader to the die, the thermal interface material having a cure temperature and comprising:
a vinyl-terminated silicone oil, the vinyl-terminated silicone oil comprising Si-vinyl groups;
a silicone chain extender comprising terminal silyl hydride (Si—H) functional groups;
a silicon crosslinker comprising silyl hydride (Si—H) functional groups, wherein the molar ratio of total Si—H functional groups from the silicon chain extender and the silicon crosslinker to the Si-vinyl groups of the vinyl-terminated silicone oil in the thermal interface material is in the range of 0.8-1.2, and wherein a total composition of the thermal interface material comprises 3-15% by weight of the vinyl-terminated silicon oil, 0.1-3% of the silicon crosslinker, and 0.1-3% of the silicon chain extender; and
a thermally conductive filler comprising at least 85 percent by weight of the material, and comprising surface wetted particles with a range of shapes and sizes,
wherein the surface wetted particles comprise a first agent having a boiling point below the cure temperature of the material and a second agent having a boiling point above the cure temperature of the material,
wherein the first agent is formed as a layer of adsorbed molecules on a surface of the filler particles and is present in a quantity sufficient to be adsorbed by and coat the filler particles with no excess first agent that is not adsorbed,
wherein the second agent is applied on the layer in a quantity sufficient to reduce the viscosity of the material, and
wherein the thermal interface material has a volatile content less than 0.2 weight percent at 150° C.

13. The package of claim 12 , wherein the silicone crosslinker is a random co-polymer comprising at least three silicone-hydrogen bonds (Si—H).

Assignees

• Intel Corp

Inventors

• Lowe Jr Randall D
• Jain Syadwad
• Matayabas Jr James C

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title