Structure, and electronic component and electronic device including the structure

Patent metadata

Field	Value
Publication number	US-2017338166-A1
Application number	US-201715429930-A
Country	US
Kind code	A1
Filing date	Feb 10, 2017
Priority date	May 20, 2016
Publication date	Nov 23, 2017
Grant date	—

Abstract

Provided herein is a structure having desirable heat dissipation, particularly a structure having high far-infrared emissivity. An electronic component including such a structure, and an electronic device including the electronic component are also provided. The structure includes a water-based coating material containing inorganic fillers that include a first filler and a second filler. The first filler is an oxide containing at least two elements selected from the group consisting of aluminum, magnesium, and silicon, and has a specific surface area of 7 m 2 /g to 50 m 2 /g, and a hydrophobic group on a filler surface. The second filler has a head conductivity of 30 W/m·K or more.

First claim

What is claimed is:

1 . A structure comprising a water-based coating material containing inorganic fillers that include a first filler and a second filler,
wherein the first filler is an oxide containing at least two elements selected from the group consisting of aluminum, magnesium, and silicon, and has a specific surface area of 7 m 2 /g to 50 m 2 /g, and a hydrophobic group on a filler surface, and wherein the second filler has a heat conductivity of 30 W/m·K or more.

2 . The structure according to claim 1 , wherein the structure has a film-like shape, and the first filler and the second filler each have a concentration gradient in a thickness direction of the film-like shape.

3 . The structure according to claim 1 , wherein the first filler has a particle size of 0.6 μm to 10 μm, and the second filler has a particle size of 10 μm to 100 μm.

4 . The structure according to claim 1 , wherein the structure includes the inorganic fillers in an amount of 66.3 volume % to 85.2 volume % with respect to a total volume of the structure.

5 . An electronic component comprising the structure of claim 1 .

6 . An electronic device comprising the electronic component of claim 5 .

7 . An electronic component including a film comprising the structure of claim 1 layered thereon, wherein a concentration of the first filler becomes smaller toward the electronic device, and a concentration of second fillers becomes larger toward the heat generating device.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Nawa Honami
• Hino Hirohisa

Classifications

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/251 Primary

  Organics · CPC title

• C08K2201/005

  Additives being defined by their particle size in general · CPC title

• C08K2003/282

  Binary compounds of nitrogen with aluminium · CPC title

• C08K3/14

  Carbides · CPC title