Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising same

Patent metadata

Field	Value
Publication number	US-9809735-B2
Application number	US-201415101270-A
Country	US
Kind code	B2
Filing date	Nov 13, 2014
Priority date	Dec 4, 2013
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.

First claim

The invention claimed is:

1. A resin composition comprising:
a resin having a main chain structure including:
a unit (A) by 40 mol % to 60 mol %, the unit (A) having a biphenyl group and being represented by general formula (1):

a unit (B) by 5 mol % to 40 mol %, the unit (B) being represented by general formula (2):
—CO—R 1 —CO—  (2)

wherein R 1 represents a bivalent linear substituent (a) whose number of atoms in its main chain length is 2 to 18 and (b) which is branched or not branched; and
a unit (C) by 5 mol % to 40 mol %, the unit (C) being represented by general formula (3):
—CO—R 2 —CO—  (3)

wherein R 2 represents a bivalent linear substituent (a) whose number of atoms in its main chain length is 4 to 20 and is larger than the number of atoms in the main chain length of R 1 and (b) which is branched or not branched,
where a total amount of the units (A), (B), and (C) is 100 mol %, and a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and
an inorganic filler having thermal conductivity of not less than 1 W/(m·K).

2. The resin composition as set forth in claim 1 , wherein R 1 and R 2 of the resin are linear saturated aliphatic hydrocarbon chains.

3. The resin composition as set forth in claim 1 , wherein R 1 and R 2 of the resin have respective main chain lengths of even numbers.

4. The resin composition as set forth in claim 1 , wherein R 1 and R 2 satisfy general formula (4):
n−m ≧4  (4)

where m represents the number of atoms in the main chain length of R 1 , and n represents the number of atoms in the main chain length of R 2.

5. The resin composition as set forth in claim 1 , wherein the resin has a number average molecular weight of 3000 to 70000.

6. The resin composition as set forth in claim 1 , wherein the inorganic filler is one or more electrically-insulative highly thermally conductive inorganic compounds selected from the group consisting of boron nitride, aluminum nitride, silicon nitride, aluminum oxide, magnesium oxide, aluminum hydroxide, magnesium hydroxide, and diamond.

7. The resin composition as set forth in claim 1 , wherein the inorganic filler is one or more electrically-conductive highly thermally conductive inorganic compounds selected from the group consisting of graphite, a carbon nanotube, electrically-conductive metal powder, soft magnetism ferrite, carbon fiber, electrically-conductive metal fiber, and zinc oxide.

8. A heat-dissipating or heat-transferring resin material containing a resin composition as set forth in claim 1 .

9. A thermally conductive membrane containing a resin composition as set forth in claim 1 .

10. The resin composition as set forth in claim 1 , wherein not less than 90% of all chain ends of the resin are blocked with a monoamine or aliphatic monocarboxylic acid having 1 to 20 carbon atoms, the monoamine or aliphatic monocarboxylic acid being an end blocking agent.

Assignees

• Kaneka Corp

Inventors

• Yoshihara Shusuke
• Ubukata Syoji
• Matsumoto Kazuaki

Classifications

• C09K5/14 Primary

  Solid materials, e.g. powdery or granular · CPC title

• C08K7/18

  inorganic · CPC title

• C08G63/78

  Preparation processes · CPC title

• C08J2367/02

  Polyesters derived from dicarboxylic acids and dihydroxy compounds; (C08J2367/06 takes precedence) · CPC title

• C08K3/38

  Boron-containing compounds · CPC title