Phosphorus-containing epoxy resin, epoxy resin composition, prepreg, laminated plate, material for circuit board and cured product

US11421071B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11421071-B2
Application numberUS-201917271216-A
CountryUS
Kind codeB2
Filing dateAug 20, 2019
Priority dateAug 27, 2018
Publication dateAug 23, 2022
Grant dateAug 23, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An object is to provide an epoxy resin composition which exhibits excellent tracking resistance and additionally has excellent heat resistance with a Tg of 200° C. or higher and flame retardancy. Provided is an epoxy resin composition which contains a phosphorus-containing epoxy resin and a curing agent and has a phosphorus content of within a range of 1.0 to 1.8%, wherein the phosphorus-containing epoxy resin has a ratio (L/H) of 0.6 to 4.0 of the content of trinuclear bodies (L) to the content of hepta or higher nuclear bodies (H) measured by GPC, and is a product obtained from a novolac epoxy resin having an average number of functional groups (Mn/E) of 3.8 to 4.8 and a phosphorus compound represented by the following general formula (1) and/or general formula (2).

First claim

Opening claim text (preview).

The invention claimed is: 1. An epoxy resin composition which contains a phosphorus-containing epoxy resin and a curing agent and has a phosphorus content of within a range of 1.0 to 1.8 mass %, wherein the phosphorus-containing epoxy resin is a product obtained from a novolac epoxy resin having a ratio (L/H) of the content (area %, L) of trinuclear bodies to the content (area %, H) of hepta or higher nuclear bodies measured by gel permeation chromatography of within a range of 0.6 to 4.0, and having an average number of functional groups (Mn/E) obtained by dividing a number average molecular weight (Mn) based on a standard polystyrene conversion value by an epoxy equivalent (E) of within a range of 3.8 to 4.8, and a phosphorus compound represented by the following general formula (1) and/or general formula (2): in the formulas, R 1 and R 2 are a hydrocarbon group having 1 to 20 carbon atoms which may have heteroatoms, and may be different from each other or may be the same, and may be linear, branched, or cyclic, or R 1 and R 2 may be bonded to form a cyclic structure site; n1 and n2 each independently represent 0 or 1; and A represents a trivalent aromatic hydrocarbon group having 6 to 20 carbon atoms. 2. The epoxy resin composition according to claim 1 , wherein the novolac epoxy resin is a phenol novolac epoxy resin. 3. The epoxy resin composition according to claim 1 , wherein the curing agent contains one or more selected from among dicyandiamide, phenolic resins and oxazine resins. 4. A prepreg in which the epoxy resin composition according to claim 1 is impregnated into a substrate. 5. A laminated plate which is a cured product of the epoxy resin composition according to claim 1 . 6. A material for circuit boards, the material being obtained by using the epoxy resin composition according to claim 1 . 7. A cured product obtained by curing the epoxy resin composition according to claim 1 . 8. A method of producing a phosphorus-containing epoxy resin obtained from a novolac epoxy resin and a phosphorus compound represented by the following general formula (1) and/or general formula (2), and in which the novolac epoxy resin has a ratio (L/H) of the content (area %, L) of trinuclear bodies to the content (area %, H) of hepta or higher nuclear bodies measured by gel permeation chromatography of within a range of 0.6 to 4.0, and an average number of functional groups (Mn/E) obtained by dividing a number average molecular weight (Mn) based on a standard polystyrene conversion value by an epoxy equivalent (E) of within a range of 3.8 to 4.8: in the formula, R 1 and R 2 are a hydrocarbon group having 1 to 20 carbon atoms which may have heteroatoms, and may be different from each other or may be the same, and may be linear, branched, or cyclic, or R 1 and R 2 may be bonded to form a cyclic structure site; n1 and n2 each independently represent 0 or 1; and A represents a trivalent aromatic hydrocarbon group having 6 to 20 carbon atoms.

Assignees

Inventors

Classifications

  • C08G59/063Primary

    with epihalohydrins · CPC title

  • containing phosphorus · CPC title

  • using glass fibres · CPC title

  • containing phosphorus · CPC title

  • characterised by the additives used in the prepolymer mixture · CPC title

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Frequently asked questions

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What does patent US11421071B2 cover?
An object is to provide an epoxy resin composition which exhibits excellent tracking resistance and additionally has excellent heat resistance with a Tg of 200° C. or higher and flame retardancy. Provided is an epoxy resin composition which contains a phosphorus-containing epoxy resin and a curing agent and has a phosphorus content of within a range of 1.0 to 1.8%, wherein the phosphorus-contai…
Who is the assignee on this patent?
Nippon Steel Chemical & Mat Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08G59/063. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 23 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).