Thermosetting resin composition, and prepreg and substrate using same

Patent metadata

Field	Value
Publication number	US-10774173-B2
Application number	US-201716313298-A
Country	US
Kind code	B2
Filing date	Jun 29, 2017
Priority date	Jun 27, 2016
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

The present invention relates to a thermosetting resin composition, and a prepreg and a printed circuit board using the same and, more particularly, to a thermosetting resin composition, and a prepreg and a printed circuit board using the same, wherein the thermosetting resin composition can be used for a printed circuit board which simultaneously has excellent low dielectric loss characteristics, good moisture absorption and heat resistance, low thermal expansion characteristics, and thermal stability.

First claim

The invention claimed is:

1. A thermosetting resin composition comprising:
(i) a benzoxazine-based compound having two or more allyl groups at the terminal,
(ii) an epoxy resin having two or more epoxy rings,
(iii) an active ester-modified curing agent, and
(iv) a nitrogen-based curing agent,
wherein the (i) benzoxazine-based compound having two or more allyl groups at the terminal comprises at least one selected from the compounds of the following formulas 1 to 4:

wherein
Z is —R′—(S)n-R″—, wherein R′ and R″ are the same or different from each other and each independently are a C1 to C5 alkylene group, and n is an integer of 1 to 4;
R 1 to R 13 are the same or different from each other and each independently are H, a halogen, a carboxyl group, a C1 to C20 alkyl group, a C3 to C20 cycloalkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C2 to C20 alkoxy group, a C6 to C20 aryl group, a C7 to C20 aralkyl group, or an allyl group, wherein the aryl group or the aralkyl group includes a fused ring;
R 14 and R 15 are the same or different from each other and each independently are a C6-C20 aryl group, a C7-C20 aralkyl group, or an allyl group;
o is an integer of 1 to 5; and
p and q are each independently an integer of 0 to 5.

2. The thermosetting resin composition according to claim 1 , wherein the thermosetting resin composition comprises from 1 to 50% by weight of the benzoxazine-based compound, from 30 to 80% by weight of the epoxy resin, from 5 to 30% by weight of the active ester-modified curing agent, and from 0.0001 to 5% by weight of the nitrogen-based curing agent, each based on the total weight of the composition.

3. A prepreg formed by impregnating a fiber substrate with the thermosetting resin composition according to claim 2 .

4. The prepreg according to claim 3 , wherein the fiber substrate comprises at least one selected from the group consisting of glass fiber, glass paper, glass fiber nonwoven fabric, glass fabric, aramid fiber, aramid paper, polyester fiber, carbon fiber, inorganic fiber and organic fiber.

5. A printed circuit board formed by laminating the prepreg of claim 3 in one or more layers.

6. The thermosetting resin composition according to claim 1 , wherein the (ii) epoxy resin comprises a dicyclopentadiene-based epoxy resin having an epoxy equivalent of from 200 to 500 g/eq.

7. A prepreg formed by impregnating a fiber substrate with the thermosetting resin composition according to claim 6 .

8. The prepreg according to claim 7 , wherein the fiber substrate comprises at least one selected from the group consisting of glass fiber, glass paper, glass fiber nonwoven fabric, glass fabric, aramid fiber, aramid paper, polyester fiber, carbon fiber, inorganic fiber and organic fiber.

9. A printed circuit board formed by laminating the prepreg of claim 7 in one or more layers.

10. The thermosetting resin composition according to claim 1 , wherein the (iii) active ester-modified curing agent comprises at least one curing agent selected from the group consisting of a phenol ester-based curing agent, a thiophenol ester-based curing agent, an N-hydroxylamine ester-based curing agent, and a heterocyclic hydroxy compound ester-based curing agent.

11. A prepreg formed by impregnating a fiber substrate with the thermosetting resin composition according to claim 10 .

12. The prepreg according to claim 11 , wherein the fiber substrate comprises at least one selected from the group consisting of glass fiber, glass paper, glass fiber nonwoven fabric, glass fabric, aramid fiber, aramid paper, polyester fiber, carbon fiber, inorganic fiber and organic fiber.

13. A printed circuit board formed by laminating the prepreg of claim 11 in one or more layers.

14. The thermosetting resin composition according to claim 1 , wherein the (iv) nitrogen-based curing agent comprises at least one curing agent selected from the group consisting of an amine-based curing agent, a triazine-phenol-based curing agent, a carbodiimide-based curing agent, and a cyanate ester-based curing agent.

15. A prepreg formed by impregnating a fiber substrate with the thermosetting resin composition according to claim 14 .

16. The prepreg according to claim 15 , wherein the fiber substrate comprises at least one selected from the group consisting of glass fiber, glass paper, glass fiber nonwoven fabric, glass fabric, aramid fiber, aramid paper, polyester fiber, carbon fiber, inorganic fiber and organic fiber.

17. A printed circuit board formed by laminating the prepreg of claim 15 in one or more layers.

18. A prepreg formed by impregnating a fiber substrate with the thermosetting resin composition according to claim 1 .

19. The prepreg according to claim 18 , wherein the fiber substrate comprises at least one selected from the group consisting of glass fiber, glass paper, glass fiber nonwoven fabric, glass fabric, aramid fiber, aramid paper, polyester fiber, carbon fiber, inorganic fiber and organic fiber.

20. A printed circuit board formed by laminating the prepreg of claim 18 in one or more layers.

Assignees

• Kolon Inc

Inventors

• Cho Hee Jin
• Sung Do Kyung
• Nam Sae Rom

Classifications

• C08J5/249

  characterised by the additives used in the prepolymer mixture · CPC title

• C08J5/246

  using polymer based synthetic fibres · CPC title

• C08J5/244

  using glass fibres · CPC title

• C08J5/243

  using carbon fibres · CPC title

• C08J5/04

  Reinforcing macromolecular compounds with loose or coherent fibrous material · CPC title