One component (1K) curable adhesive composition
US-12180398-B2 · Dec 31, 2024 · US
containing halogen atoms
containing halogen atoms · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/308 |
| Official title | {containing halogen atoms} |
| Display label | containing halogen atoms |
| Total patents | 66 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 5 |
| 2016 | 5 |
| 2017 | 3 |
| 2018 | 5 |
| 2019 | 3 |
| 2020 | 10 |
| 2021 | 7 |
| 2022 | 9 |
| 2023 | 6 |
| 2024 | 8 |
| 2025 | 4 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Flame-retardant epoxy resin composition
US-2024417560-A1 · Dec 19, 2024 · US
Electromagnetic and thermal shields with low-dimensional materials
US-12137546-B2 · Nov 5, 2024 · US
Curable resin, curable resin composition, cured product, electronic device, laminated board material, electronic component encapsulant, and method for producing curable resin
US-12098238-B2 · Sep 24, 2024 · US
Resin composition and article made therefrom
US-2024199791-A1 · Jun 20, 2024 · US
Flow cells
US-11975478-B2 · May 7, 2024 · US
Fluorine-containing epoxy resin for electrical materials and method for manufacturing same
US-11965060-B2 · Apr 23, 2024 · US
Flame retardant formulations for wood coating
US-2023365817-A1 · Nov 16, 2023 · US
Novolak Resin, Epoxy Resin, Photosensitive Resin Composition, Curable Resin Composition, Cured Substance, Electronic Device, Production Method for Novolak Resin, and Production Method for Epoxy Resin
US-2023125986-A1 · Apr 27, 2023 · US
Antimony free flame-retarded epoxy compositions
US-2023128079-A1 · Apr 27, 2023 · US
Curable Resin, Curable Resin Composition, Cured Product, Electronic Device, Laminated Board Material, Electronic Component Encapsulant, and Method for Producing Curable Resin
US-2023097638-A1 · Mar 30, 2023 · US
Antimony free flame-retarded epoxy compositions
US-11560448-B2 · Jan 24, 2023 · US
Fluorine-containing ether compound, lubricant for magnetic recording medium, and magnetic recording medium
US-11555005-B2 · Jan 17, 2023 · US
One component (1k) curable adhesive composition
US-2022411673-A1 · Dec 29, 2022 · US
Dust core and electronic device
US-2022406501-A1 · Dec 22, 2022 · US
Dust core and electronic device
US-2022406502-A1 · Dec 22, 2022 · US
Composition, curable composition, and cured product
US-2022298294-A1 · Sep 22, 2022 · US
Electromagnetic and thermal shields with low-dimensional materials
US-2022264775-A1 · Aug 18, 2022 · US
Polymer, electrolyte, and lithium-ion battery employing the same
US-2022216511-A1 · Jul 7, 2022 · US
Epoxy resin, resin composition, resin sheet, resin cured product, resin substrate and multilayer substrate
US-2022185948-A1 · Jun 16, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/308?
- CPC C08G59/308 is the Cooperative Patent Classification code for “containing halogen atoms.”
- How many patents are filed under CPC C08G59/308 (containing halogen atoms)?
- Our database includes 66 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/308 growing?
- Publication counts under this code: 8 in 2024 vs 4 in 2025 (latest complete years).