Fluorine-containing epoxy resin for electrical materials and method for manufacturing same

Patent metadata

Field	Value
Publication number	US-11965060-B2
Application number	US-202117533359-A
Country	US
Kind code	B2
Filing date	Nov 23, 2021
Priority date	Jun 12, 2019
Publication date	Apr 23, 2024
Grant date	Apr 23, 2024

Abstract

A fluorine-containing epoxy resin for an electronic component represented by the following formula (E) wherein n is an integer of 0 or greater, an average value of n is 0.18 or smaller, and M is a group represented by the following formula (E1), a group represented by the following formula (E2), or a group represented by the following formula (E3) wherein Z is hydrogen or a C2-C10 fluoroalkyl group. The formula (E) being:the formula (E1) being:the formula (E2) being:the formula (E3) being:Also disclosed is a method for producing the fluorine-containing epoxy resin as well as a curable composition containing the fluorine-containing epoxy resin and a curing agent.

First claim

What is claimed is:

1. A high frequency printed circuit board comprising a substrate coated with a film of a curable composition comprising:
a fluorine-containing epoxy resin represented by the following formula (E):

wherein n is an integer of 0 or greater; an average value of n is 0.10 or smaller; and M is a group represented by the following formula (E2):

 and
a curing agent, wherein the curing agent is at least one selected from the group consisting of polyamines, polycarboxylic acids, acid anhydrides, phenols, imidazoles, polymercaptans, and organic acid hydrazides,
wherein the amount of the curing agent is 0.1 to 50 parts by mass relative to 100 parts by mass of the fluorine-containing epoxy resin.

2. The high frequency printed circuit board according to claim 1 ,
wherein the average value of n is 0.09 to 0.10.

3. The high frequency printed circuit board according to claim 1 ,
wherein the fluorine-containing epoxy resin has a ratio by mole of a 1,3-isomer of the group represented by the formula (E2) to a 1,4-isomer thereof (1,3-isomer/1,4-isomer) of 0/100 to 100/0.

4. The high frequency printed circuit board according to claim 1 , which optionally further comprises a compound represented by the following formula (F):

wherein M and n are defined as described above, in an amount of up to 10% by mass.

5. The high frequency printed circuit board according to claim 1 , which optionally further comprises a fluorine-containing diol represented by the following formula (G):
HO-M-OH
wherein M is defined as described above, in an amount of up to 10% by mass.

6. A method for producing the high frequency printed circuit board according to claim 1 comprising:
reacting a fluorine-containing diol represented by the following formula (G):
HO-M-OH

wherein M is a group represented by the following formula (E2):

with a compound containing a double bond to provide a fluorine-containing olefin containing two double bonds;
oxidizing the fluorine-containing olefin to provide the fluorine-containing epoxy resin,
mixing the fluorine-containing epoxy resin and the curing agent to prepare the curable composition, and
applying the curable composition to the substrate to provide the coating film.

Assignees

• Daikin Ind Ltd

Inventors

• Tanaka Yoshito
• Yoshida Tomohiro

Classifications

• H05K1/034

  containing halogen · CPC title

• C08G59/5073

  having two nitrogen atoms in the ring · CPC title

• C08G59/245

  aromatic · CPC title

• C08G59/308 Primary

  containing halogen atoms · CPC title

• C08G59/027 Primary

  obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer · CPC title