Curable resin, curable resin composition, cured product, electronic device, laminated board material, electronic component encapsulant, and method for producing curable resin

Patent metadata

Field	Value
Publication number	US-12098238-B2
Application number	US-202117800336-A
Country	US
Kind code	B2
Filing date	Feb 24, 2021
Priority date	Feb 28, 2020
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

A curable resin represented by General Formula (1). In General Formula (1), R1 each independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R2's are each independently a monovalent group including a polymerizable functional group.

First claim

The invention claimed is:

1. A curable resin represented by General Formula (1),

in General Formula (1),
R 1 each independently represent a monovalent substituent,
m is 0 to 4,
n is 0 to 40, and
R 2 's are each independently a monovalent group including a polymerizable functional group,
wherein R 2 is a monovalent group including an epoxy group or a monovalent group including an ethylenically unsaturated group.

2. The curable resin according to claim 1 ,
wherein R 2 is a monovalent group including a glycidyl group or a monovalent group including an epoxy (meth)acrylate skeleton.

3. The curable resin according to claim 1 ,
wherein R 1 is at least one selected from the group consisting of an alkyl group, an alkoxy group, a cycloalkyl group, an aryl group, an alkenyl group, an alkynyl group, an aryloxy group, an amino group, an alkylamino group, an arylamino group, a cyano group, a nitro group, a silyl group, and a halogeno group.

4. The curable resin according to claim 1 ,
wherein the curable resin is represented by General Formula (2),

in General Formula (2), R 1 , m, and n have the same definitions as in General Formula (1).

5. The curable resin according to claim 1 ,
wherein the curable resin is represented by General Formula (3),

in General Formula (3), R 1 , m, and n have the same definitions as in General Formula (1) and two R 3 's are each independently hydrogen or a methyl group.

6. The curable resin according to claim 1 ,
wherein the curable resin is represented by General Formula (4),

in General Formula (4), n has the same definition as in General Formula (1).

7. The curable resin according to claim 1 ,
wherein the curable resin is represented by General Formula (5),

in General Formula (5), n has the same definition as in General Formula (1).

8. The curable resin according to claim 1 ,
wherein the curable resin is represented by General Formula (6),

in General Formula (6), n has the same definition as in General Formula (1).

9. The curable resin according to claim 1 ,
wherein the curable resin is represented by General Formula (7),

in General Formula (7), n has the same definition as in General Formula (1).

10. The curable resin according to claim 1 ,
wherein the curable resin is represented by General Formula (8),

in General Formula (8), n has the same definition as in General Formula (1).

11. The curable resin according to claim 1 ,
wherein the curable resin is represented by General Formula (9),

in General Formula (9), n has the same definition as in General Formula (1).

12. The curable resin according to claim 1 ,
wherein a total chlorine content is 0 ppm to 4000 ppm.

13. The curable resin according to claim 1 ,
wherein the curable resin is liquid at 40° C.

14. The curable resin according to claim 1 ,
wherein a curable resin in which n is 0 and a curable resin in which n is 1 to 40, in General Formula (1), are included.

15. A curable resin composition comprising:
the curable resin according to claim 1 .

16. The curable resin composition according to claim 15 , further comprising: a curing agent.

17. A cured product comprising:
the curable resin composition according to claim 15 .

18. An electronic device comprising:
the cured product according to claim 17 .

19. A laminated board material comprising:
the curable resin composition according to claim 15 ; or
a cured product of the curable resin composition.

20. An electronic component encapsulant comprising:
the curable resin composition according to claim 15 ; or
a cured product of the curable resin composition.

21. A method for producing the curable resin according to claim 1 , comprising:
reacting a bisphenol compound represented by General Formula (10) with epihalohydrin in the presence of a base,

in General Formula (10), R 1 and m have the same definitions as in General Formula (1).

22. The method for producing the curable resin according to claim 1 , further comprising:
reacting an epoxy resin compound represented by General Formula (2) with (meth)acrylic acid,

in General Formula (2), R 1 , m and n have the same definitions as in General Formula (1).

23. The method for producing the curable resin according to claim 1 , further comprising:
reacting a bisphenol compound represented by General Formula (10) with glycidyl (meth)acrylate,

in General Formula (10), R 1 and m have the same definitions as in General Formula (1).

Assignees

• Central Glass Co Ltd

Inventors

• Hirotaki Kensuke
• Nagura Hirokatsu
• Hosoi Kenji
• Hara Yukari

Classifications

• H10W74/47 Primary

  comprising organic materials, e.g. plastics or resins · CPC title

• C08F222/1063

  of alcohol terminated polyethers · CPC title

• C08G59/308

  containing halogen atoms · CPC title

• C08G59/14

  Polycondensates modified by chemical after-treatment · CPC title

• C08G59/1466

  Acrylic or methacrylic acids · CPC title