White heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same
US-2017365756-A1 · Dec 21, 2017 · US
Mixtures of di-epoxy compounds
Mixtures of di-epoxy compounds · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/226 |
| Official title | {Mixtures of di-epoxy compounds} |
| Display label | Mixtures of di-epoxy compounds |
| Total patents | 364 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 30 |
| 2016 | 20 |
| 2017 | 27 |
| 2018 | 25 |
| 2019 | 40 |
| 2020 | 43 |
| 2021 | 43 |
| 2022 | 28 |
| 2023 | 24 |
| 2024 | 35 |
| 2025 | 42 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Curable adhesive compositions for flexible substrates
US-2017349794-A1 · Dec 7, 2017 · US
Thermally expandable preparations
US-9790341-B2 · Oct 17, 2017 · US
Photosensitive resin composition for optical waveguide and photocurable film for forming optical waveguide core layer, and optical waveguide and opto-electric transmission hybrid flexible printed wiring board using same
US-2017291984-A1 · Oct 12, 2017 · US
Resin composition
US-2017275453-A1 · Sep 28, 2017 · US
Oxygen barrier compositions and related methods
US-9695334-B2 · Jul 4, 2017 · US
Epoxy resin composition, prepreg, and carbon-fiber-reinforced composite material
US-9683072-B2 · Jun 20, 2017 · US
Dental composition
US-2017156992-A1 · Jun 8, 2017 · US
Oxazolidone ring containing adducts
US-2017015778-A1 · Jan 19, 2017 · US
Resin composition
US-2017009071-A1 · Jan 12, 2017 · US
Multi-component composition
US-2016368822-A1 · Dec 22, 2016 · US
Processes for producing viscous epoxy syrups and epoxy syrups obtainable thereby
US-2016355634-A1 · Dec 8, 2016 · US
Liquid resin composition
US-2016340470-A1 · Nov 24, 2016 · US
Curable composition
US-2016333135-A1 · Nov 17, 2016 · US
Adhesive for polarizing plate and polarizing plate including the same
US-9487685-B2 · Nov 8, 2016 · US
Oxazolidone ring containing adducts
US-9481757-B2 · Nov 1, 2016 · US
Epoxy resin composition, and film, prepreg, and fiber-reinforced plastic using same
US-2016297959-A1 · Oct 13, 2016 · US
Epoxy resin composition and printed circuit board including insulating layer using the epoxy resin composition
US-9462689-B2 · Oct 4, 2016 · US
Vibration dampening compositions
US-9453101-B2 · Sep 27, 2016 · US
Filling material for three-dimensional mounting of semiconductor element
US-2016237201-A1 · Aug 18, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/226?
- CPC C08G59/226 is the Cooperative Patent Classification code for “Mixtures of di-epoxy compounds.”
- How many patents are filed under CPC C08G59/226 (Mixtures of di-epoxy compounds)?
- Our database includes 364 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/226 growing?
- Publication counts under this code: 35 in 2024 vs 42 in 2025 (latest complete years).