Filling material for three-dimensional mounting of semiconductor element

Patent metadata

Field	Value
Publication number	US-2016237201-A1
Application number	US-201415024910-A
Country	US
Kind code	A1
Filing date	Sep 25, 2014
Priority date	Sep 27, 2013
Publication date	Aug 18, 2016
Grant date	—

Abstract

Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.

First claim

1 . A filling component for three-dimensional mounting of semiconductor elements,
the filling component being used for filling gaps between laterally adjacent semiconductor elements in production of a three-dimensional integrated semiconductor device by stacking and integrating a plurality of semiconductor elements, the filling component being a component that is polished and/or ground flat from a front side of the semiconductor elements while the gaps between the semiconductor elements are filled with the filling component.

2 . The filling component according to claim 1 for three-dimensional mounting of semiconductor elements,
wherein the filling component is a cured product of a curable composition comprising:
an epoxide having a bisphenol skeleton; and
a cationic-polymerization initiator.

3 . A curable composition for three-dimensional mounting of semiconductor elements, the curable composition being used for the formation of the filling component according to claim 1 for three-dimensional mounting of semiconductor elements,
the curable composition comprising:
an epoxide having a bisphenol skeleton; and
a cationic-polymerization initiator,

the curable composition being liquid at 25° C.

4 . The curable composition according to claim 3 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
a cycloaliphatic epoxide.

5 . The curable composition according to claim 3 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
at least one filler selected from the group consisting of inorganic fillers and organic fillers each having an average particle diameter of 0.05 to 1 μm.

6 . The curable composition according to claim 3 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
a silane coupling agent.

7 . A curable composition for three-dimensional mounting of semiconductor elements, the curable composition being used for the formation of the filling component according to claim 2 for three-dimensional mounting of semiconductor elements,
the curable composition comprising:
an epoxide having a bisphenol skeleton; and
a cationic-polymerization initiator,

the curable composition being liquid at 25° C.

8 . The curable composition according to claim 4 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
at least one filler selected from the group consisting of inorganic fillers and organic fillers each having an average particle diameter of 0.05 to 1 μm.

9 . The curable composition according to claim 4 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
a silane coupling agent.

10 . The curable composition according to claim 5 for three-dimensional mounting of semiconductor elements, the curable composition further comprising
a silane coupling agent.

Assignees

• Daicel Corp

Inventors

• Tanaka Hiroki
• Nakaguchi Katsuhiro

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/874

  On different surfaces · CPC title