Highly alkali-stable poly(arylene alkylene piperidinium) cationic polymers and preparation methods and applications
US-2025376553-A1 · Dec 11, 2025 · US
of aldehydes
of aldehydes · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G10/02 |
| Official title | of aldehydes |
| Display label | of aldehydes |
| Total patents | 34 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2017 | 2 |
| 2018 | 2 |
| 2019 | 4 |
| 2020 | 3 |
| 2021 | 1 |
| 2022 | 3 |
| 2023 | 5 |
| 2024 | 2 |
| 2025 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Highly alkali-stable poly(arylene alkylene piperidinium) cationic polymer having branched structure, and preparation method and use thereof
US-2025376554-A1 · Dec 11, 2025 · US
Composition for forming resist underlayer film with improved film density
US-12449732-B2 · Oct 21, 2025 · US
Method for forming protective film, method for manufacturing patterned substrate, and composition
US-12312487-B2 · May 27, 2025 · US
Method For Forming Resist Underlayer Film And Patterning Process
US-2025060670-A1 · Feb 20, 2025 · US
Coating composition for forming resist underlayer film for EUV lithography process
US-12228858-B2 · Feb 18, 2025 · US
Hardmask composition, hardmask layer and method of forming patterns
US-2024319602-A1 · Sep 26, 2024 · US
Resist underlayer film formation composition
US-2024103369-A1 · Mar 28, 2024 · US
Aromatic Thermoset Resins
US-2023391946-A1 · Dec 7, 2023 · US
Resist underlayer film-forming composition
US-2023259031-A1 · Aug 17, 2023 · US
Method for forming protective film, method for manufacturing patterned substrate, and composition
US-2023242787-A1 · Aug 3, 2023 · US
Curing agent, adhesive composition for semiconductor comprising same, adhesive film for semiconductor, and semiconductor package using same
US-2023220153-A1 · Jul 13, 2023 · US
Hardmask composition, hardmask layer, and method of forming patterns
US-2023221641-A1 · Jul 13, 2023 · US
Resist composition, method for forming resist pattern, and polyphenol compound used therein
US-11480877-B2 · Oct 25, 2022 · US
Composition for forming resist underlayer film having improved flattening properties
US-11287742-B2 · Mar 29, 2022 · US
Compound, resist composition, and method for forming resist pattern using it
US-11256170-B2 · Feb 22, 2022 · US
Composition for forming organic film, substrate for manufacturing semiconductor device, method for forming organic film, and patterning process
US-11018015-B2 · May 25, 2021 · US
Composition for film formation for lithography, film for lithography, method for forming resist pattern, and method for forming circuit pattern
US-2020354501-A1 · Nov 12, 2020 · US
Composition for forming resist underlayer film having improved flattening properties
US-2020174370-A1 · Jun 4, 2020 · US
Coating composition for forming resist underlayer film for euv lithography process
US-2020133126-A1 · Apr 30, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G10/02?
- CPC C08G10/02 is the Cooperative Patent Classification code for “of aldehydes.”
- How many patents are filed under CPC C08G10/02 (of aldehydes)?
- Our database includes 34 publications tagged with this CPC code.
- Is patent activity under CPC C08G10/02 growing?
- Publication counts under this code: 2 in 2024 vs 6 in 2025 (latest complete years).