Composition for forming resist underlayer film with improved film density

US12449732B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12449732-B2
Application numberUS-201716097523-A
CountryUS
Kind codeB2
Filing dateApr 25, 2017
Priority dateApr 28, 2016
Publication dateOct 21, 2025
Grant dateOct 21, 2025

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  1. Title

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A resist underlayer film formation composition including a novolak resin that has a repeating unit structure represented by the following formula (1). (In formula (1), groups A and B are organic groups which each have an aromatic ring, a fused aromatic ring, or a fused aromatic heterocycle and have a structure in which two or more mono- or divalent chemical groups selected from the group consisting of chemical groups (a) that cause an increase in mass upon oxidation, groups (b) that form a crosslink upon heating, and groups (c) that induce phase separation during curing have replaced hydrogen atoms on the ring(s) contained in group A and/or B.) The composition further includes a crosslinking agent and an acid and/or acid generator. A production process is provided in which the resist underlayer film formation composition is applied to a semiconductor substrate and burned to obtain a resist underlayer film.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for producing a resist underlayer film, the method comprising applying and baking a resist underlayer film-forming composition on a semiconductor substrate so as to obtain the resist underlayer film, wherein the resist underlayer film-forming composition comprises a novolak resin having a repeating unit structure consisting of the following formula (1): wherein a group A is an organic group that includes a ring structure comprising an aromatic ring selected from the group consisting of benzene, naphthalene and diphenylamine and a group B is each independently an organic group that includes a ring structure comprising an aromatic ring, a condensed aromatic ring, or a condensed aromatic hetero ring, wherein the repeating unit structure of formula (1) further includes two or more same or different mono- or divalent chemical groups selected from the group consisting of chemical group (a) that is sulfide group, chemical group (b) that is amino group, carboxyl group, a carboxylic acid alkyl ester group, nitro group, hydroxy group, ether group, or a combination thereof, with a proviso that chemical group (b) does not include a secondary amino group, and chemical group (c) that is a fluoroalkyl group, by way of the mono- or divalent chemical groups each being substituted for a hydrogen atom bonded to a carbon atom in the ring structure of the group A and/or of the group B; wherein, in the two or more mono- or divalent chemical groups, at least one is selected from the chemical group (b); wherein if the group A is diphenylamine: the amino group of the diphenylamine is one of the two or more mono- or divalent chemical groups; chemical group (a) is a sulfide group; chemical group (b) is a carboxylic acid alkyl ester group, an ether group, or a combination thereof; and chemical group (c) is a fluoroalkyl group. 2. A method for producing a semiconductor device, the method comprising: a step of forming a resist underlayer film from a resist underlayer film-forming composition on a semiconductor substrate; a step of forming a resist film on the resist underlayer film; a step of forming a resist pattern through irradiation with light or an electron beam and development; a step of etching the underlayer film with the formed resist pattern; and a step of processing the semiconductor substrate with the patterned underlayer film, wherein the resist underlayer film-forming composition comprises a novolak resin having a repeating unit structure consisting of the following formula (1): wherein a group A is an organic group that includes a ring structure comprising an aromatic ring selected from the group consisting of benzene, naphthalene and diphenylamine and a group B is each independently an organic group that includes a ring structure comprising an aromatic ring, a condensed aromatic ring, or a condensed aromatic hetero ring, wherein the repeating unit structure of formula (1) further includes two or more same or different mono- or divalent chemical groups selected from the group consisting of chemical group (a) that is sulfide group, chemical group (b) that is amino group, carboxyl group, a carboxylic acid alkyl ester group, nitro group, hydroxy group, ether group, or a combination thereof, with a proviso that chemical group (b) does not include a secondary amino group, and chemical group (c) that is a fluoroalkyl group, by way of the mono- or divalent chemical groups each being substituted for a hydrogen atom bonded to a carbon atom in the ring structure of the group A and/or of the group B; wherein, in the two or more mono- or divalent chemical groups, at least one is selected from the chemical group (b); wherein if the group A is diphenylamine: the amino group of the diphenylamine is one of the two or more mono- or divalent chemical groups; chemical group (a) is a sulfide group; chemical group (b) is a carboxylic acid alkyl ester group, an ether group, or a combination thereof; and chemical group (c) is a fluoroalkyl group. 3. A method for producing a semiconductor device, the method comprising: a step of forming a resist underlayer film from a resist underlayer film-forming composition on a semiconductor substrate; a step of forming a hard mask on the resist underlayer film; a step of further forming a resist film on the hard mask; a step of forming a resist pattern through irradiation with light or an electron beam and development; a step of etching the hard mask with the formed resist pattern; a step of etching the underlayer film with the patterned hard mask; and a step of processing the semiconductor substrate with the patterned resist underlayer film, wherein the resist underlayer film-forming composition comprises a novolak resin having a repeating unit structure consisting of the following formula (1): wherein a group A is an organic group that includes a ring structure comprising an aromatic ring selected from the group consisting of benzene, naphthalene and diphenylamine and a group B is each independently an organic group that includes a ring structure comprising an aromatic ring, a condensed aromatic ring, or a condensed aromatic hetero ring, wherein the repeating unit structure of formula (1) further includes two or more same or different mono- or divalent chemical groups selected from the group consisting of chemical group (a) that is sulfide group, chemical group (b) that is amino group, carboxyl group, a carboxylic acid alkyl ester group, nitro group, hydroxy group, ether group, or a combination thereof, with a proviso that chemical group (b) does not include a secondary amino group, and chemical group (c) that is a fluoroalkyl group, by way of the mono- or divalent chemical groups each being substituted for a hydrogen atom bonded to a carbon atom in the ring structure of the group A and/or of the group B; wherein, in the two or more mono- or divalent chemical groups, at least one is selected from the chemical group (b); wherein if the group A is diphenylamine: the amino group of the diphenylamine is one of the two or more mono- or divalent chemical groups; and chemical group (a) is a sulfide group; chemical group (b) is a carboxylic acid alkyl ester group, an ether group, or a combination thereof; and chemical group (c) is a fluoroalkyl group. 4. A resist underlayer film-forming composition comprising a novolak resin having a repeating unit structure selected from the group consisting of:

Assignees

Inventors

Classifications

  • characterised by their composition, e.g. multilayer masks · CPC title

  • of masks comprising organic materials · CPC title

  • Processing photosensitive materials; Apparatus therefor (G03F7/12 - G03F7/24 take precedence) · CPC title

  • with heterocyclic compounds · CPC title

  • C08G12/08Primary

    aromatic · CPC title

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What does patent US12449732B2 cover?
A resist underlayer film formation composition including a novolak resin that has a repeating unit structure represented by the following formula (1). (In formula (1), groups A and B are organic groups which each have an aromatic ring, a fused aromatic ring, or a fused aromatic heterocycle and have a structure in which two or more mono- or divalent chemical groups selected from the group consis…
Who is the assignee on this patent?
Nissan Chemical Corp
What technology area does this patent fall under?
Primary CPC classification C08G12/08. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 21 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).