Organotin alkoxides as precursors for patterning compositions with fluorine substituents and carbon-carbon double bonds
US-2024427239-A1 · Dec 26, 2024 · US
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containing a metal
containing a metal · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08F30/04 |
| Official title | containing a metal |
| Display label | containing a metal |
| Total patents | 13 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 3 |
| 2018 | 1 |
| 2019 | 2 |
| 2021 | 3 |
| 2023 | 2 |
| 2024 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Tellurium-containing compound, polymer, and method for producing polymer
US-2023312771-A1 · Oct 5, 2023 · US
Production of ring polymers from terminal alkynes by alkylidynes
US-11708430-B2 · Jul 25, 2023 · US
Production of Ring Polymers from Terminal Alkynes by Alkylidynes
US-2021395402-A1 · Dec 23, 2021 · US
Pattern forming method, method for manufacturing electronic device, monomer for producing resin for semiconductor device manufacturing process, resin, method for producing resin, actinic ray-sensitive or radiation-sensitive resin composition, and actinic ray-sensitive or radiation-sensitive film
US-11150557-B2 · Oct 19, 2021 · US
Radiation-sensitive composition, pattern-forming method, and metal-containing resin and production method thereof
US-11079676-B2 · Aug 3, 2021 · US
Radiation-sensitive composition, pattern-forming method, and metal-containing resin and production method thereof
US-2019310552-A1 · Oct 10, 2019 · US
Radiation-sensitive composition, pattern-forming method and metal oxide
US-2019310551-A1 · Oct 10, 2019 · US
Pattern forming method, method for manufacturing electronic device, monomer for producing resin for semiconductor device manufacturing process, resin, method for producing resin, actinic ray-sensitive or radiation-sensitive resin composition, and actinic ray-sensitive or radiation-sensitive film
US-2018299776-A1 · Oct 18, 2018 · US
Negative resist composition, method of forming resist pattern and complex
US-9499646-B2 · Nov 22, 2016 · US
Negative resist composition, method of forming resist pattern and complex
US-2016259244-A1 · Sep 8, 2016 · US
Negative resist composition, method of forming resist pattern, and complex
US-9366960-B2 · Jun 14, 2016 · US
Negative resist composition, method of forming resist pattern, and complex
US-2015192851-A1 · Jul 9, 2015 · US