Negative resist composition, method of forming resist pattern, and complex

US9366960B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9366960-B2
Application numberUS-201414558977-A
CountryUS
Kind codeB2
Filing dateDec 3, 2014
Priority dateDec 5, 2013
Publication dateJun 14, 2016
Grant dateJun 14, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A negative resist composition including a complex represented by the general formula (1); and a polymerization initiator. in which M represents hafnium (Hf) or zirconium (Zr), X represents a ligand including a conjugate base of an acid which has an acid dissociation constant (pKa) of 3.8 or less and has a polymerizable group, Y represents a ligand having no polymerizable group, and n represents an integer of 1 to 4. [MX n Y 4-n ]  (1)

First claim

Opening claim text (preview).

What is claimed is: 1. A negative resist composition comprising: a complex represented by the following general formula (1): [MX n Y 4-n ]  (1) wherein M represents hafnium (Hf) or zirconium (Zr), X represents a ligand comprising a conjugate base of an acid which has an acid dissociation constant (pKa) of 3.8 or less and has a polymerizable group, Y represents a ligand having no polymerizable group, and n represents an integer of 1 to 4; a polymerization initiator; and an organic solvent. 2. A method of forming a resist pattern, comprising: forming a resist film on a substrate using the negative resist composition of claim 1 ; conducting exposure of the resist film; and developing the resist film after the exposure to form a resist pattern. 3. The negative resist composition according to claim 1 , wherein the acid dissociation constant (pKa) of the acid is 2.8 or less. 4. The negative resist composition according to claim 1 , wherein X in the formula (1) is a ligand comprising a conjugate base represented by general formula (2) shown below: R 1 —Y 1 —SO 3 θ   (2) wherein, in formula (2), R 1 represents a polymerizable group having a group selected from groups respectively represented by formulae (X-01) to (X-07) shown below, and Y 1 represents a divalent linking group or a single bond; wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, Ar represents an aromatic hydrocarbon group, n represents an integer of 0 to 2, and * represents a valence bond. 5. The negative resist composition according to claim 1 , wherein X in the formula (1) is a ligand comprising a conjugate base selected from the group consisting of a conjugate base of 3-(methacryloyloxy)-1-propanesulfonic acid, a conjugate base of 3-(acryloyloxy)-1-propanesulfonic acid, a conjugated base of vinylsulfonic acid, and a conjugated base of styrenesulfonic acid. 6. The negative resist composition according to claim 1 , wherein X in the formula (1) is a ligand comprising a conjugate base represented by general formula (3) shown below: R 2 —Y 2 —COO θ   (3) wherein, in formula (3), R 2 represents a polymerizable group having a group selected from groups respectively represented by formulae (X-01) to (X-07) shown below, and Y 2 represents a divalent linking group or a single bond: wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms, Ar represents an aromatic hydrocarbon group, n represents an integer of 0 to 2, and * represents a valence bond. 7. The negative resist composition according to claim 1 , wherein X in the formula (1) is a ligand comprising a conjugate base selected from the group consisting of a conjugate base of carboxymethyl methacrylate, and a conjugate base of carboxymethyl acrylate. 8. The negative resist composition according to claim 1 , wherein M represents hafnium (Hf). 9. The negative resist composition according to claim 1 , wherein M represents zirconium (Zr). 10. The method according to claim 2 , wherein the resist film is exposed with EB or EUV.

Assignees

Inventors

Classifications

  • G03F7/038Primary

    Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

  • with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image · CPC title

  • metal compounds not provided for in groups C08G18/225 - C08G18/26 · CPC title

  • Metals or metal containing compounds · CPC title

  • Metallic compounds other than hydrides and other than metallo-organic compounds; Boron halide or aluminium halide complexes with organic compounds containing oxygen · CPC title

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What does patent US9366960B2 cover?
A negative resist composition including a complex represented by the general formula (1); and a polymerization initiator. in which M represents hafnium (Hf) or zirconium (Zr), X represents a ligand including a conjugate base of an acid which has an acid dissociation constant (pKa) of 3.8 or less and has a polymerizable group, Y represents a ligand having no polymerizable group, and n represents…
Who is the assignee on this patent?
Tokyo Ohka Kogyo Co Ltd, Tokyo Oha Kogyo Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/038. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 14 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).