Ceramic honeycomb structure and its production method
US-12552723-B2 · Feb 17, 2026 · US
wherein the active component for bonding is not the largest fraction of the interlayer
wherein the active component for bonding is not the largest fraction of the interlayer · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2237/09 |
| Official title | wherein the active component for bonding is not the largest fraction of the interlayer |
| Display label | wherein the active component for bonding is not the largest fraction of the interlayer |
| Total patents | 49 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 1 |
| 2017 | 10 |
| 2018 | 2 |
| 2019 | 1 |
| 2020 | 8 |
| 2021 | 3 |
| 2022 | 1 |
| 2023 | 2 |
| 2024 | 5 |
| 2025 | 2 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Filter and method for manufacturing same
US-12305551-B2 · May 20, 2025 · US
Holding device and method of manufacturing holding device
US-12273965-B2 · Apr 8, 2025 · US
Joining material with silicon carbide particles and reactive additives
US-12180122-B2 · Dec 31, 2024 · US
Ceramic honeycomb structure and its production method
US-2024368042-A1 · Nov 7, 2024 · US
Holding device and method of manufacturing holding device
US-12114402-B2 · Oct 8, 2024 · US
Composite panels and methods for manufacturing the same
US-2024253333-A1 · Aug 1, 2024 · US
Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method
US-12027434-B2 · Jul 2, 2024 · US
Joining material and silicon carbide based honeycomb structure
US-11767270-B2 · Sep 26, 2023 · US
Joining material with silicon carbide particles and reactive additives
US-2023192564-A1 · Jun 22, 2023 · US
Honeycomb structure and method for producing honeycomb structure
US-11426688-B2 · Aug 30, 2022 · US
Metal-on-ceramic substrates
US-11046051-B2 · Jun 29, 2021 · US
Copper-ceramic bonded body and insulation circuit substrate
US-11028022-B2 · Jun 8, 2021 · US
Holding device and method of manufacturing holding device
US-2021037613-A1 · Feb 4, 2021 · US
Holding device and method of manufacturing holding device
US-2020404747-A1 · Dec 24, 2020 · US
Filter and method for manufacturing same
US-2020386134-A1 · Dec 10, 2020 · US
Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method
US-2020365475-A1 · Nov 19, 2020 · US
Ceramic material composite comprising a bonding layer of a molybdenum-titanium carbide composite material, component, gas turbine, and method
US-2020354279-A1 · Nov 12, 2020 · US
Copper/ceramic joined body, insulated circuit board, method for producing copper/ceramic joined body, and method for producing insulated circuit board
US-10818585-B2 · Oct 27, 2020 · US
Honeycomb structure and method for producing honeycomb structure
US-2020306677-A1 · Oct 1, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2237/09?
- CPC C04B2237/09 is the Cooperative Patent Classification code for “wherein the active component for bonding is not the largest fraction of the interlayer.”
- How many patents are filed under CPC C04B2237/09 (wherein the active component for bonding is not the largest fraction of the interlayer)?
- Our database includes 49 publications tagged with this CPC code.
- Is patent activity under CPC C04B2237/09 growing?
- Publication counts under this code: 5 in 2024 vs 2 in 2025 (latest complete years).