Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method

Patent metadata

Field	Value
Publication number	US-12027434-B2
Application number	US-201916960648-A
Country	US
Kind code	B2
Filing date	Jan 16, 2019
Priority date	Jan 25, 2018
Publication date	Jul 2, 2024
Grant date	Jul 2, 2024

Abstract

A bonded body of copper and ceramic includes: a copper member made of copper or a copper alloy and a ceramic member made of an aluminum oxide, the copper member and the ceramic member being bonded to each other; a magnesium oxide layer which is formed on a ceramic member side between the copper member and the ceramic member; and a Mg solid solution layer which is formed between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase, in which one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer.

First claim

What is claimed is:

1. A bonded body of copper and ceramic comprising:
a copper member made of copper or a copper alloy and a ceramic member made of an aluminum oxide, the copper member and the ceramic member being bonded to each other;
a magnesium oxide layer which is formed on a ceramic member side between the copper member and the ceramic member; and
a Mg solid solution layer which is formed between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase,
wherein one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer; and
wherein a thickness of the magnesium oxide layer is in a range of 50 nm or more and 1000 nm or less.

2. The bonded body of copper and ceramic according to claim 1 ,
wherein intermetallic compound phases containing Cu and the one or more active metals are dispersed in the Mg solid solution layer.

3. The bonded body of copper and ceramic according to claim 1 ,
wherein Cu particles are dispersed in the magnesium oxide layer.

4. The bonded body of copper and ceramic according to claim 1 ,
wherein a ratio of an area of Cu—Mg intermetallic compound phases in an area of a region from a bonding surface of the ceramic member to 50 μm toward a copper member side is 15% or less.

5. An insulating circuit substrate comprising:
a copper sheet made of copper or a copper alloy and a ceramic substrate made of an aluminum oxide, the copper sheet being bonded to a surface of the ceramic substrate;
a magnesium oxide layer which is formed between the copper sheet and the ceramic substrate on a ceramic substrate side; and
a Mg solid solution layer which is formed between the magnesium oxide layer and the copper sheet and contains Mg in a state of a solid solution in a Cu primary phase,
wherein one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer; and
wherein a thickness of the magnesium oxide layer is in a range of 50 nm or more and 1000 nm or less.

6. The insulating circuit substrate according to claim 5 ,
wherein intermetallic compound phases containing Cu and the one or more active metals are dispersed in the Mg solid solution layer.

7. The insulating circuit substrate according to claim 5 ,
wherein Cu particles are dispersed in the magnesium oxide layer.

8. The insulating circuit substrate according to claim 5 ,
wherein a ratio of an area of Cu—Mg intermetallic compound phases in an area of a region from a bonding surface of the ceramic substrate to 50 μm toward a copper sheet side is 15% or less.

Assignees

• Mitsubishi Materials Corp

Inventors

• Terasaki Nobuyuki

Classifications

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/6875 Primary

  being on a metallic substrate, e.g. insulated metal substrates [IMS] · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title