Plate
US-11970681-B2 · Apr 30, 2024 · US
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Marking
Marking · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C99/007 |
| Official title | {Marking} |
| Display label | Marking |
| Total patents | 15 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2016 | 2 |
| 2018 | 4 |
| 2019 | 1 |
| 2020 | 1 |
| 2021 | 4 |
| 2023 | 2 |
| 2024 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Package-on-package (pop) type semiconductor packages
US-2023223387-A1 · Jul 13, 2023 · US
Package-on-package (POP) type semiconductor packages
US-11610871-B2 · Mar 21, 2023 · US
Semiconductor device
US-2021280527-A1 · Sep 9, 2021 · US
Plate
US-2021253988-A1 · Aug 19, 2021 · US
Alignment mark and semiconductor device, and fabrication methods thereof
US-11049816-B2 · Jun 29, 2021 · US
Package-on-package (pop) type semiconductor packages
US-2021074691-A1 · Mar 11, 2021 · US
Alignment mark and semiconductor device, and fabrication methods thereof
US-2020161251-A1 · May 21, 2020 · US
Method of arranging a plurality of semiconductor structural elements on a carrier and carrier comprising a plurality of semiconductor structural elements
US-10381311-B2 · Aug 13, 2019 · US
Alignment pattern for package singulation
US-10163807-B2 · Dec 25, 2018 · US
Manufacturing method for a micromechanical device including an oblique surface and corresponding micromechanical device
US-2018257932-A1 · Sep 13, 2018 · US
Method of arranging a plurality of semiconductor structural elements on a carrier and carrier comprising a plurality of semiconductor structural elements
US-2018247896-A1 · Aug 30, 2018 · US
Alignment Pattern for Package Singulation
US-2018151507-A1 · May 31, 2018 · US
Methodology and system for wafer-level testing of MEMS pressure sensors
US-9527731-B2 · Dec 27, 2016 · US
Methodology and system for wafer-level testing of mems pressure sensors
US-2016107887-A1 · Apr 21, 2016 · US