Micromechanical device with contact pad
US-2022363532-A1 · Nov 17, 2022 · US
during manufacturing
during manufacturing · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C99/004 |
| Official title | {during manufacturing} |
| Display label | during manufacturing |
| Total patents | 80 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 9 |
| 2017 | 13 |
| 2018 | 8 |
| 2019 | 8 |
| 2020 | 7 |
| 2021 | 5 |
| 2022 | 6 |
| 2023 | 3 |
| 2024 | 8 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Capacitance gap measurement
US-2022234883-A1 · Jul 28, 2022 · US
Structure and methodology for detecting defects during MEMS device production
US-11377348-B2 · Jul 5, 2022 · US
Processing apparatus
US-2021242061-A1 · Aug 5, 2021 · US
Redundant sensor system with self-test of electromechanical structures
US-2021155473-A1 · May 27, 2021 · US
Structure and methodology for detecting defects during mems device production
US-2021155474-A1 · May 27, 2021 · US
Structure and methodology for detecting defects during MEMS device production
US-10941037-B2 · Mar 9, 2021 · US
Apparatus and method for packaging, handling or testing of sensors
US-10935569-B2 · Mar 2, 2021 · US
Apparatus and method for packaging, handling or testing of sensors
US-10782315-B2 · Sep 22, 2020 · US
Adaptive cavity thickness control for micromachined ultrasonic transducer devices
US-2020269279-A1 · Aug 27, 2020 · US
Sensor characteristic evaluation method and charged particle beam device
US-10737937-B2 · Aug 11, 2020 · US
Singulation of wafer level packaging
US-2020231434-A1 · Jul 23, 2020 · US
Structure and methodology for detecting defects during mems device production
US-2020207618-A1 · Jul 2, 2020 · US
MEMS device
US-10654717-B2 · May 19, 2020 · US
Singulation of wafer level packaging
US-10611632-B1 · Apr 7, 2020 · US
Method of manufacturing semiconductor device
US-10522429-B2 · Dec 31, 2019 · US
Apparatus and method for testing a capacitive transducer and/or associated electronic circuitry
US-10451667-B2 · Oct 22, 2019 · US
Sensor characteristic evaluation method and charged particle beam device
US-2019292046-A1 · Sep 26, 2019 · US
Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures
US-10343896-B2 · Jul 9, 2019 · US
Methods for fabricating electronic devices including substantially hermetically sealed cavities and getter films
US-10336608-B2 · Jul 2, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C99/004?
- CPC B81C99/004 is the Cooperative Patent Classification code for “during manufacturing.”
- How many patents are filed under CPC B81C99/004 (during manufacturing)?
- Our database includes 80 publications tagged with this CPC code.
- Is patent activity under CPC B81C99/004 growing?
- Publication counts under this code: 8 in 2024 vs 5 in 2025 (latest complete years).