Drop test device for a micromechanical component
US-2026008671-A1 · Jan 8, 2026 · US
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Temporary protection of devices or parts of the devices during manufacturing
Temporary protection of devices or parts of the devices during manufacturing · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C2201/05 |
| Official title | Temporary protection of devices or parts of the devices during manufacturing |
| Display label | Temporary protection of devices or parts of the devices during manufacturing |
| Total patents | 10 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity appears stable based on the most recent years.
| Year | Patents |
|---|---|
| 2016 | 3 |
| 2017 | 3 |
| 2018 | 3 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Temporary mechanical stabilization of semiconductor cavities
US-9988262-B2 · Jun 5, 2018 · US
Methods and structures of integrated MEMS-CMOS devices
US-9950924-B2 · Apr 24, 2018 · US
Temporary mechanical stabilization of semiconductor cavities
US-2018086632-A1 · Mar 29, 2018 · US
MEMS package with MEMS die, magnet, and window substrate fabrication method and structure
US-9758372-B1 · Sep 12, 2017 · US
Semiconductor structure and fabrication method thereof
US-9718682-B2 · Aug 1, 2017 · US
Semiconductor structure and fabrication method thereof
US-2017029272-A1 · Feb 2, 2017 · US
Chip Package and a Method of Producing the Same
US-2016311679-A1 · Oct 27, 2016 · US
Methods and Structures of Integrated MEMS-CMOS Devices
US-2016176708-A1 · Jun 23, 2016 · US
Methods and structures of integrated MEMS-CMOS devices
US-9276080-B2 · Mar 1, 2016 · US