Common mode rejection structures for mems devices
US-12492119-B2 · Dec 9, 2025 · US
in or on a substrate
in or on a substrate · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C2201/01 |
| Official title | in or on a substrate |
| Display label | in or on a substrate |
| Total patents | 54 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 10 |
| 2018 | 7 |
| 2019 | 8 |
| 2020 | 7 |
| 2021 | 2 |
| 2022 | 6 |
| 2023 | 5 |
| 2024 | 2 |
| 2025 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for assembling two substrates by molecular adhesion and structure obtained by such a method
US-2025256955-A1 · Aug 14, 2025 · US
Common mode rejection structures for mems devices
US-2025002331-A1 · Jan 2, 2025 · US
Undercut-free patterned aluminum nitride structure and methods for forming the same
US-2024368746-A1 · Nov 7, 2024 · US
Undercut-free patterned aluminum nitride structure and methods for forming the same
US-12134824-B2 · Nov 5, 2024 · US
MEMS device with electrodes and a dielectric
US-11753295-B2 · Sep 12, 2023 · US
Method for coating microstructured components
US-11701478-B2 · Jul 18, 2023 · US
Mems device with electrodes and a dielectric
US-2023166966-A1 · Jun 1, 2023 · US
MEMS device with electrodes and a dielectric
US-11554953-B2 · Jan 17, 2023 · US
Liquid guiding boundaries for porous substrates providing increased biodegradability
US-11554384-B2 · Jan 17, 2023 · US
MEMs membrane structure and method of fabricating same
US-11530129-B2 · Dec 20, 2022 · US
Undercut-free patterned aluminum nitride structure and methods for forming the same
US-2022325396-A1 · Oct 13, 2022 · US
Device chip manufacturing method
US-11469142-B2 · Oct 11, 2022 · US
Undercut-free patterned aluminum nitride structure and methods for forming the same
US-11371133-B2 · Jun 28, 2022 · US
Mems device with electrodes and a dielectric
US-2022177301-A1 · Jun 9, 2022 · US
Undercut-free patterned aluminum nitride structure and methods for forming the same
US-2022018009-A1 · Jan 20, 2022 · US
Infrared detector pixel structure and manufacturing method thereof
US-11034577-B2 · Jun 15, 2021 · US
Method for sealing an access opening to a cavity and MEMS component comprising a sealing element
US-10913656-B2 · Feb 9, 2021 · US
Device chip manufacturing method
US-2020343139-A1 · Oct 29, 2020 · US
Liquid guiding boundaries for porous substrates providing increased biodegradability
US-2020324541-A1 · Oct 15, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C2201/01?
- CPC B81C2201/01 is the Cooperative Patent Classification code for “in or on a substrate.”
- How many patents are filed under CPC B81C2201/01 (in or on a substrate)?
- Our database includes 54 publications tagged with this CPC code.
- Is patent activity under CPC B81C2201/01 growing?
- Publication counts under this code: 2 in 2024 vs 3 in 2025 (latest complete years).