MEMS device with electrodes and a dielectric

Patent metadata

Field	Value
Publication number	US-11753295-B2
Application number	US-202218079519-A
Country	US
Kind code	B2
Filing date	Dec 12, 2022
Priority date	Dec 3, 2020
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

A MEMS device can include a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side. The MEMS device can include a first plurality of electrodes extending completely through a first subset of the plurality of apertures, a second plurality of electrodes extending partially through a second subset of the plurality of apertures, a third plurality of electrodes extending partially into a third subset of the plurality of apertures. The MEMS device can include a first diaphragm coupled to the first plurality and to the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric. The MEMS device can include a second diaphragm coupled to the first plurality and to the second plurality of electrodes the second diaphragm facing the second side of the solid dielectric.

First claim

We claim:

1. A microelectromechanical systems (MEMS) device comprising:
a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side;
a first plurality of electrodes extending completely through a first subset of the plurality of apertures;
a second plurality of electrodes extending partially through a second subset of the plurality of apertures;
a third plurality of electrodes extending partially into a third subset of the plurality of apertures;
a first diaphragm coupled to the first plurality and to the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric; and
a second diaphragm coupled to the first plurality and to the second plurality of electrodes the second diaphragm facing the second side of the solid dielectric.

2. The MEMS device according to claim 1 , wherein a low-pressure region is established between the first and second diaphragms.

3. The MEMS device according to claim 1 , further comprising:
a first interconnect electrically connecting the electrodes of the first plurality;
a second interconnect electrically connecting the electrodes of the second plurality; and
a third interconnect electrically connecting the electrodes of the third plurality.

4. The MEMS device according to claim 1 , wherein the electrodes of the first, second, and third plurality of electrodes are pins.

5. The MEMS device according to claim 1 ,
wherein a first capacitance exists between the first plurality of electrodes and the second plurality of electrodes, and
wherein a second capacitance exists between the first plurality of electrodes and the third plurality of electrodes.

6. The MEMS device according to claim 1 , further comprising a fourth plurality of electrodes, the fourth plurality of electrodes having first ends and second ends,
wherein the dielectric surrounds first ends of the first plurality of electrodes and the second ends of the fourth plurality of electrodes, and
wherein second ends of the first plurality of electrodes and the first ends of the fourth plurality of electrode are located outside the dielectric.

7. The MEMS device according to claim 1 ,
wherein the dielectric comprises a first surface on the first side and a second surface on the second side,
wherein second ends of the first plurality of electrodes and second ends of the third plurality of electrodes extend beyond the second surface, and
and wherein first ends of the second plurality of electrode extend beyond the first surface.

8. The MEMS device according to claim 1 , wherein the dielectric is movable relative to the first, second, and third pluralities of electrodes.

9. The MEMS device according to claim 1 , wherein the position of the first plurality of electrodes is fixed relative to the position of the second plurality of electrodes and the third plurality of electrodes, and the position of the second plurality of electrodes is fixed relative to the position of the third plurality of electrodes.

10. A sensor package comprising:
a microelectromechanical systems (MEMS) transducer comprising:
a solid dielectric including a plurality of apertures, the solid dielectric having a first side and a second side,
a first plurality of electrodes extending completely through a first subset of the plurality of apertures,
a second plurality of electrodes extending partially through a second subset of the plurality of apertures,
a third plurality of electrodes extending partially into a third subset of the plurality of apertures,
a first diaphragm coupled to the first plurality and to the third plurality of electrodes, the first diaphragm facing the first side of the solid dielectric,
a second diaphragm coupled to the first plurality and to the second plurality of electrodes the second diaphragm facing the second side of the solid dielectric; and

an enclosure that includes a cover and a base,
wherein the cover is attached to the base, the enclosure having a sound port, and
wherein the MEMS transducer is disposed within the enclosure and acoustically coupled to the sound port.

11. The sensor package of claim 10 , wherein the sound port is an aperture in the base.

12. The sensor package of claim 10 , wherein the sound port is on the cover.

Assignees

• Knowles Electronics Llc

Inventors

• Loeppert Peter V
• Pedersen Michael

Classifications

• B81B2201/0257

  Microphones or microspeakers · CPC title

• B81B7/0032

  Packages or encapsulation (processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023) · CPC title

• B81B7/02 Primary

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title

• B81C1/00166 Primary

  Electrodes · CPC title