Method for sealing an access opening to a cavity and MEMS component comprising a sealing element

Patent metadata

Field	Value
Publication number	US-10913656-B2
Application number	US-201816162026-A
Country	US
Kind code	B2
Filing date	Oct 16, 2018
Priority date	Oct 18, 2017
Publication date	Feb 9, 2021
Grant date	Feb 9, 2021

Abstract

A method for sealing an access opening to a cavity comprises the following steps: providing a layer arrangement having a first layer structure and a cavity arranged adjacent to the first layer structure, wherein the first layer structure has an access opening to the cavity, performing a CVD layer deposition for forming a first covering layer having a layer thickness on the first layer structure having the access opening, and performing an HDP layer deposition with a first and second substep for forming a second covering layer on the first covering layer, wherein the first substep comprises depositing a liner material layer on the first covering layer, wherein the second substep comprises partly backsputtering the liner material layer and furthermore the first covering layer in the region of the access opening, and wherein the first and second substeps are carried out alternately and repeatedly a number of times.

First claim

What is claimed is:

1. A method for sealing an access opening to a cavity, comprising the following steps:
providing a layer arrangement having a first layer structure and a cavity arranged adjacent to the first layer structure, wherein the first layer structure has an access opening to the cavity,
performing a CVD layer deposition for forming a first covering layer having a layer thickness on the first layer structure having the access opening, and
performing an HDP layer deposition with a first and second substep for forming a second covering layer on the first covering layer,
wherein the first substep comprises depositing a liner material layer on the first covering layer,
wherein the second substep comprises partly backsputtering the liner material layer and furthermore the first covering layer in a region of the access opening,
wherein the first and second substeps are carried out alternately and repeatedly a number of times, and
wherein the liner material layer extends only as far as a lower edge of the access opening.

2. The method as claimed in claim 1 , wherein, when performing the HDP layer deposition, the access opening through the first layer structure to the cavity is hermetically sealed at an atmospheric reduced pressure, and a cavity having the atmospheric reduced pressure is obtained.

3. The method as claimed in claim 1 , wherein process parameters of the HDP layer deposition are set such that in the first substep and at least reduced sputtering power is set in order to perform the liner material layer deposition, and
in the second substep a composition of a process gas used is set to perform the backsputtering with an at least reduced material application.

4. The method as claimed in claim 3 , wherein the process parameters of the HDP layer deposition are set such that
the first substep is performed without sputtering power, and
the second substep is performed without material application.

5. The method as claimed in claim 1 , wherein the access opening has a diameter, and wherein the layer thickness of the first covering layer is chosen in order to obtain a size ratio between a layer thickness D 240 of the first covering layer and an inner minimum diameter of the access opening which is in the range of between 0.3 and 1.0.

6. The method as claimed in claim 1 , wherein the access opening is configured as a regular convex polygon.

7. The method as claimed in claim 1 , further comprising the following step:
applying a further seal layer on the second covering layer to form a covering layer stack.

8. The method as claimed in claim 7 , further comprising the following step:
structuring the covering layer stack, to form a local sealing element at the access opening.

9. The method as claimed in claim 1 , wherein the first layer structure has a plurality of access openings to the cavity, wherein, when performing the HDP layer deposition, the plurality of access openings through the first layer structure to the cavity are hermetically sealed and an atmospheric reduced pressure is formed in the cavity.

10. The method as claimed in claim 1 , wherein the layer arrangement has a second layer structure that is spaced apart from the first layer structure, and wherein the cavity is arranged at least in sections between the first and second layer structures, wherein the second layer structure furthermore has at least one access opening to the cavity, and
wherein, when performing the CVD layer deposition, a first covering layer having the layer thickness is formed on the second layer structure having the at least one access opening, and
wherein, when performing the HDP layer deposition, a second continuous covering layer is formed on the first covering layer of the second layer structure.

11. The method as claimed in claim 10 , wherein the second layer structure has a plurality of further access openings to the cavity, and wherein, when performing the HDP layer deposition, the plurality of further access openings through the second layer structure to the cavity are hermetically sealed and an atmospheric reduced pressure is formed in the cavity.

12. The method as claimed in claim 1 , wherein the layer arrangement is part of a MEMS component having a MEMS layer system on a carrier substrate with a double-membrane arrangement and a counter electrode structure situated therebetween.

13. The method as claimed in claim 12 , wherein the MEMS component is configured as a vacuum microphone.

14. The MEMS component formed by the method of claim 12 .

15. The method as claimed in claim 1 wherein, when performing the HDP layer deposition, an initial step is carried out before the first substep, wherein the initial step comprises partly backsputtering the first covering layer in the region of the access opening.

16. The method as claimed in claim 15 , wherein process parameters of the HDP layer deposition are chosen to set a composition of a process gas used in the initial step such that the backsputtering is performed with an at least reduced material application.

17. The method as claimed in claim 16 , wherein the process parameters of the HDP layer deposition are set such that the initial step is carried out without material application.

18. A MEMS component comprising:
a layer arrangement having a first layer structure and a cavity arranged adjacent to the first layer structure, wherein the first layer structure has an access opening to the cavity; and
a structured covering layer stack for forming a local sealing element at the access opening, wherein the local sealing element has a layer sequence comprising a CVD layer and an HDP layer,
wherein the structured covering layer stack partially extends into the access opening only as far as a lower edge of the access opening.

19. The MEMS component as claimed in claim 18 , wherein the MEMS component is configured as a vacuum microphone and has a MEMS layer system on a carrier substrate with a double-membrane arrangement and a counter electrode structure situated therebetween.

20. A method of forming a MEMS component, the method comprising:
forming a layer arrangement having a first layer structure and a cavity arranged adjacent to the first layer structure, wherein the first layer structure has an access opening to the cavity; and
forming a structured covering layer stack for forming a local sealing element at the access opening, wherein the local sealing element has a layer sequence comprising a CVD layer and an HDP layer,
wherein the structured covering layer stack is formed to partially extend into the access opening only as far as a lower edge of the access opening.

Assignees

• Infineon Technologies Ag

Inventors

• Metzger-Brueckl Gerhard
• Dehe Alfons
• Hoeckele Uwe
• Strasser Johann
• Walther Arnaud

Classifications

• B81C2203/01

  Packaging MEMS · CPC title

• B81C2201/01

  in or on a substrate · CPC title

• B81C1/00261 Primary

  Processes for packaging MEMS devices (MEMS packages B81B7/0032, packaging of smart-MEMS B81C1/0023) · CPC title

• B81C1/00182 Primary

  Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer · CPC title

• B81B7/0032

  Packages or encapsulation (processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023) · CPC title