Method for producing a composite cap element, and composite cap element
US-2025178888-A1 · Jun 5, 2025 · US
Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C1/00436 |
| Official title | {Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate} |
| Display label | Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate |
| Total patents | 37 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 2 |
| 2017 | 3 |
| 2018 | 4 |
| 2019 | 2 |
| 2020 | 8 |
| 2021 | 7 |
| 2022 | 4 |
| 2023 | 1 |
| 2024 | 3 |
| 2025 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for manufacturing a micromechanical fastening element, shaping tool for producing an impression of the micromechanical fastening element, and micromechanical fastening element
US-2024269795-A1 · Aug 15, 2024 · US
Method for producing a micromechanical device comprising a cavity having a melt seal
US-2024262682-A1 · Aug 8, 2024 · US
Method with stealth dicing process for fabricating MEMS semiconductor chips
US-11939216-B2 · Mar 26, 2024 · US
Micro-electro-mechanical system (MEMS) thermal sensor
US-11796396-B2 · Oct 24, 2023 · US
MEMs membrane structure and method of fabricating same
US-11530129-B2 · Dec 20, 2022 · US
Pressure Sensor Device and Method for Forming a Pressure Sensor Device
US-2022221363-A1 · Jul 14, 2022 · US
Pressure sensor device and method for forming a pressure sensor device
US-11313749-B2 · Apr 26, 2022 · US
Method and device for a carrier proximity mask
US-11232930-B2 · Jan 25, 2022 · US
Method with stealth dicing process for fabricating mems semiconductor chips
US-2021309513-A1 · Oct 7, 2021 · US
Micro-electro-mechanical sytem (mems) thermal sensor
US-2021215550-A1 · Jul 15, 2021 · US
Method and device for a carrier proximity mask
US-2021210308-A1 · Jul 8, 2021 · US
Method and device for a carrier proximity mask
US-10991547-B2 · Apr 27, 2021 · US
Thin metal membrane with support
US-10973420-B2 · Apr 13, 2021 · US
Micro-electro-mechanical system (MEMS) thermal sensor
US-10962424-B2 · Mar 30, 2021 · US
Method and device for a carrier proximity mask
US-2021090858-A1 · Mar 25, 2021 · US
Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component
US-10775253-B2 · Sep 15, 2020 · US
Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component
US-2020225108-A1 · Jul 16, 2020 · US
Mems membrane structure and method of fabricating same
US-2020165123-A1 · May 28, 2020 · US
Micro-electro-mechanical device and manufacturing process thereof
US-10626008-B2 · Apr 21, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C1/00436?
- CPC B81C1/00436 is the Cooperative Patent Classification code for “Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate.”
- How many patents are filed under CPC B81C1/00436 (Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate)?
- Our database includes 37 publications tagged with this CPC code.
- Is patent activity under CPC B81C1/00436 growing?
- Publication counts under this code: 3 in 2024 vs 1 in 2025 (latest complete years).