Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component

Patent metadata

Field	Value
Publication number	US-10775253-B2
Application number	US-201716330552-A
Country	US
Kind code	B2
Filing date	Aug 24, 2017
Priority date	Sep 6, 2016
Publication date	Sep 15, 2020
Grant date	Sep 15, 2020

Abstract

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

First claim

What is claimed is:

1. A method for manufacturing a micromechanical component, the method comprising:
applying an electrically conductive sacrificial element in or on a first outer surface of a first substrate;
applying a second substrate on the sacrificial element over the first outer surface of the first substrate;
performing anodic etching of the second substrate to form a pressure sensor;
applying on the second substrate an oxide layer having at least one opening;
introducing an etchant through the at least one opening to etch the second substrate, thereby
forming in the second substrate at least one trench that extends to the sacrificial element; and
at least partly removing the sacrificial element in order to disengage the pressure sensor, wherein at least part of the oxide layer, which is left on the micromechanical component, suspends the disengaged pressure sensor.

2. The method of claim 1 , wherein the sacrificial element is in monocrystalline or polycrystalline form.

3. The method of claim 1 , wherein the sacrificial element includes germanium.

4. The method of claim 1 , wherein the removing of the sacrificial element includes etching with xenon difluoride or chlorine trifluoride.

5. The method of claim 1 , wherein the applying of the sacrificial element includes applying the sacrificial element over an entirety of the first outer surface of the first substrate.

6. The method of claim 1 , wherein, in the applying of the sacrificial element, the sacrificial element is applied in a laterally limited fashion on the first outer surface of the first substrate so that the sacrificial element does not cover an entirety of the first outer surface of the first substrate.

7. The method of claim 1 , wherein the second substrate includes at least one exempt area where the at least one trench is formed, the exempt area forming a suspension for the disengaged pressure sensor.

Assignees

• Bosch Gmbh Robert

Inventors

• Stahl Heiko
• Dannenberg Arne
• Haug Daniel
• Kaercher Daniel
• Mitschke Michaela
• Schwarz Mike
• Lindemann Timo

Classifications

• G01L9/008 Primary

  using piezoelectric devices (piezoelectric resonators G01L9/0022; surface acoustic waves G01L9/0025) · CPC title

• B81B2201/0264

  Pressure sensors · CPC title

• B81C1/00436

  Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate · CPC title

• B81B3/0018

  Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators · CPC title

• B81C1/00325 Primary

  for reducing stress inside of the package structure · CPC title