Method for slicing workpiece and wire saw
US-10518380-B2 · Dec 31, 2019 · US
by tools other than rotary type, e.g. reciprocating tools {(B28D5/0005 takes precedence)}
by tools other than rotary type, e.g. reciprocating tools {(B28D5/0005 takes precedence)} · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B28D5/04 |
| Official title | by tools other than rotary type, e.g. reciprocating tools {(B28D5/0005 takes precedence)} |
| Display label | by tools other than rotary type, e.g. reciprocating tools {(B28D5/0005 takes precedence)} |
| Total patents | 191 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 9 |
| 2016 | 9 |
| 2017 | 13 |
| 2018 | 19 |
| 2019 | 14 |
| 2020 | 16 |
| 2021 | 15 |
| 2022 | 23 |
| 2023 | 31 |
| 2024 | 16 |
| 2025 | 24 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method and device for producing planar modifications in solid bodies
US-2019366586-A1 · Dec 5, 2019 · US
Singulation of silicon carbide semiconductor wafers
US-2019348290-A1 · Nov 14, 2019 · US
Wire saw device and workpiece cutting method
US-10399249-B2 · Sep 3, 2019 · US
Method of manufacturing cz silicon wafers, and method of manufacturing a semiconductor device
US-2019249330-A1 · Aug 15, 2019 · US
Method of manufacturing CZ silicon wafers, and method of manufacturing a semiconductor device
US-10273597-B2 · Apr 30, 2019 · US
Method for manufacturing wire saw apparatus and wire saw apparatus
US-2019105750-A1 · Apr 11, 2019 · US
Stage for cutting substrate and substrate-cutting apparatus
US-10239161-B2 · Mar 26, 2019 · US
Apparatus for cutting substrate and system for processing same
US-10211105-B2 · Feb 19, 2019 · US
Cutting apparatus and wafer processing method
US-2019051532-A1 · Feb 14, 2019 · US
Abrasive article and method of forming
US-10137514-B2 · Nov 27, 2018 · US
Method for producing a silicon ingot having symmetrical grain boundaries
US-10131999-B2 · Nov 20, 2018 · US
Method for manufacturing a silicon cylinder by growth on seeds in a directed solidification furnace
US-10125430-B2 · Nov 13, 2018 · US
SiC wafer producing method
US-10112256-B2 · Oct 30, 2018 · US
Method for slicing workpiece and wire saw
US-2018281147-A1 · Oct 4, 2018 · US
SiC WAFER PRODUCING METHOD
US-2018218896-A1 · Aug 2, 2018 · US
Workpiece holder and method for slicing workpiece
US-2018215075-A1 · Aug 2, 2018 · US
Wafer producing method
US-10029383-B2 · Jul 24, 2018 · US
Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
US-10011046-B2 · Jul 3, 2018 · US
Wire saw device and workpiece cutting method
US-2018178409-A1 · Jun 28, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B28D5/04?
- CPC B28D5/04 is the Cooperative Patent Classification code for “by tools other than rotary type, e.g. reciprocating tools {(B28D5/0005 takes precedence)}.”
- How many patents are filed under CPC B28D5/04 (by tools other than rotary type, e.g. reciprocating tools {(B28D5/0005 takes precedence)})?
- Our database includes 191 publications tagged with this CPC code.
- Is patent activity under CPC B28D5/04 growing?
- Publication counts under this code: 16 in 2024 vs 24 in 2025 (latest complete years).