Stage for cutting substrate and substrate-cutting apparatus

Patent metadata

Field	Value
Publication number	US-10239161-B2
Application number	US-201615192910-A
Country	US
Kind code	B2
Filing date	Jun 24, 2016
Priority date	Oct 29, 2015
Publication date	Mar 26, 2019
Grant date	Mar 26, 2019

Abstract

Provided are a stage for cutting a substrate and a substrate-cutting apparatus. The stage for cutting a substrate includes: a plurality of cell areas, each of the cell areas including a first opening; an edge area at an outer side of the cell areas, the edge area including a second opening having a diameter that is larger than a diameter of the first opening; a dummy area between adjacent ones of the cell areas; and a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area.

First claim

What is claimed is:

1. A stage for cutting a substrate, the stage comprising:
a plurality of cell areas, each of the cell areas comprising a first opening;
an edge area at an outer side of the cell areas, the edge area comprising a second opening having a diameter that is larger than a diameter of the first opening;
a dummy area between adjacent ones of the cell areas; and
a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area.

2. The stage of claim 1 , further comprising a discharge line connected to the cutting groove,
wherein the discharge line is configured to discharge impurities from the cutting groove.

3. The stage of claim 2 , wherein the cutting groove is at opposite sides of the dummy area.

4. The stage of claim 2 , wherein the discharge line extends along the cutting groove and is at an outer side of each of the cell areas.

5. The stage of claim 2 , further comprising:
a first suction space connected to the first opening at a side of the cell areas; and
a second suction space connected to the second opening at a side of the edge area.

6. The stage of claim 5 , wherein the discharge line is separated from the first suction space and the second suction space.

7. The stage of claim 1 , wherein the dummy area comprises a third opening, and
wherein the third opening has a diameter that is larger than the diameter of the first opening and smaller than the diameter of the second opening.

8. The stage of claim 7 , further comprising a third suction space connected to the third opening at a side of the dummy area.

9. The stage of claim 1 , wherein the edge area further comprises:
a first slit extending along an outer side of the cell areas; and
a second slit extending toward an outer side of the first slit.

10. The stage of claim 1 , wherein an edge of at least one of the cell areas is devoid of a first opening.

11. A substrate-cutting apparatus comprising:
a stage for accommodating a substrate, the stage comprising:
a plurality of cell areas, each of the cell areas comprising a first opening;
an edge area at an outer side of the cell areas, the edge area comprising a second opening having a diameter that is larger than a diameter of the first opening;
a dummy area between adjacent ones of the cell areas; and
a cutting groove between one of the adjacent ones of the cell areas and the dummy area or between one of the cell areas and the edge area; and

a laser module for irradiating a laser beam onto the substrate,
wherein the laser beam is irradiated onto the substrate along the cutting groove.

12. The substrate-cutting apparatus of claim 11 , wherein the stage further comprises a discharge line connected to the cutting groove, and
wherein the discharge line is configured to discharge impurities generated when the laser module irradiates the laser beam onto the substrate.

13. The substrate-cutting apparatus of claim 12 , wherein the cutting groove is at opposite sides of the dummy area.

14. The substrate-cutting apparatus of claim 12 , wherein the discharge line extends along the cutting groove and is at an outer side of each of the cell areas.

15. The substrate-cutting apparatus of claim 12 , further comprising:
a first suction space connected to the first opening at a side of the cell areas; and
a second suction space connected to the second opening at a side of the edge area.

16. The substrate-cutting apparatus of claim 15 , wherein the discharge line is separated from the first suction space and the second suction space.

17. The substrate-cutting apparatus of claim 11 , wherein the dummy area comprises a third opening, and
wherein the third opening has a diameter that is larger than the diameter of the first opening and smaller than the diameter of the second opening.

18. The substrate-cutting apparatus of claim 17 , further comprising a third suction space connected to the third opening at a side of the dummy area.

19. The substrate-cutting apparatus of claim 11 , wherein the edge area further comprises:
a first slit extending along an outer side of the cell areas, and
a second slit extending toward an outer side of the first slit.

20. The substrate-cutting apparatus of claim 11 , wherein an edge of at least one of the cell areas is devoid of a first opening.

Assignees

• Samsung Display Co Ltd

Inventors

• Choi Wonwoo
• Yoon Seungho
• Lee Sangbong

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• B23K37/0408

  for planar work · CPC title

• B23K26/0622

  by shaping pulses · CPC title

• B23K26/402 Primary

  involving non-metallic material, e.g. isolators · CPC title